别让我ccc
2024-12-03
我擦，这真的假的
Production Hurdles for Nvidia's GB200 Spark Rumors of Microsoft Cutting Orders<blockquote>英伟达GB200的生产障碍引发微软削减订单的传言</blockquote>
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According to a report by the Commercial Times, NV","content":"<p><html><head></head><body>As demand for artificial intelligence continues to surge, the industry’s appetite for high-performance computing chips has grown increasingly intense. According to a report by the Commercial Times, NVIDIA’s next-generation Blackwell architecture chip, the GB200, has encountered new technical hurdles in its mass production plans. In response, CSP provider Microsoft is reportedly scaling back its orders.</p><p><blockquote><html><head></head><body>随着人工智能需求的不断激增，业界对高性能计算芯片的胃口也愈发强烈。据商业时报报道，英伟达下一代Blackwell架构芯片GB200在量产计划中遇到了新的技术障碍。据报道，作为回应，CSP提供商微软正在缩减订单。</body></html></blockquote></p><p><p class=\"t-img-caption\"><img src=\"https://community-static.tradeup.com/news/1d68eeb02c6b163c51fbae9253b663f6\" alt=\"NVIDIA Blackwell\" title=\"NVIDIA Blackwell\" tg-width=\"624\" tg-height=\"351\"/><span>NVIDIA Blackwell</span></p><p><blockquote><p class=\"t-img-caption\"><span>英伟达布莱克威尔</span></p></blockquote></p><p><p style=\"text-align: left;\">Sources within the supply chain cited by Commercial Times reveal that the issue lies in the backplane connection design. The testing yield for cartridge connectors provided by U.S. Tier-1 supplier Amphenol has been suboptimal, potentially delaying mass production until March 2025.</p><p><blockquote><p style=\"text-align: left;\">《商业时报》援引供应链内部的消息人士透露，问题出在背板连接设计上。美国一级供应商Amphenol提供的盒式连接器的测试产量一直不理想，可能会将大规模生产推迟到2025年3月。</p></blockquote></p><p><p style=\"text-align: left;\">The GB200 chips employ TSMC’s cutting-edge CoWoS-L advanced packaging technology, incorporating a highly complex cabinet design. However, this complexity has led to various challenges, including overheating in chip design, leakage issues in UQDs, and now, insufficient yield rates for copper cables. While NVIDIA announced during its recent earnings call that Blackwell production is fully underway, supply constraints remain a pressing issue that the company is working to resolve with its partners.</p><p><blockquote><p style=\"text-align: left;\">GB200芯片采用台积电尖端的CoWoS-L先进封装技术，结合了高度复杂的机柜设计。然而，这种复杂性导致了各种挑战，包括芯片设计中的过热、UQD中的泄漏问题，以及现在铜电缆的成品率不足。尽管英伟达在最近的财报看涨期权上宣布Blackwell的生产已全面展开，但供应限制仍然是该公司正在与合作伙伴努力解决的紧迫问题。</p></blockquote></p><p><p style=\"text-align: left;\">The same report, citing supply chain sources, attributes the issue to a newly developed cartridge connector module. The significant specification upgrade of the GB200 has increased production complexity, resulting in poor yield rates and failed testing, creating a major bottleneck.</p><p><blockquote><p style=\"text-align: left;\">同一份报告援引供应链消息来源，将问题归因于新开发的盒式连接器模块。GB200的重大规格升级增加了生产复杂性，导致良品率不佳和测试失败，形成了一个主要瓶颈。</p></blockquote></p><p><p style=\"text-align: left;\">NVIDIA is actively seeking alternative suppliers, but issues such as patent restrictions and capacity ramp-up delays are expected to prolong resolution efforts. While the report notes that chip production schedules remain unaffected, supply chain checks indicate that Microsoft has already cut its orders for NVIDIA by 40%, reallocating some to the GB300 chips set for release in mid-2025.</p><p><blockquote><p style=\"text-align: left;\">英伟达正在积极寻求替代供应商，但专利限制和产能提升延迟等问题预计将延长解决工作。虽然报告指出芯片生产计划仍未受到影响，但供应链检查表明，微软已经将NVIDIA的订单削减了40%，将部分订单重新分配给定于2025年中期发布的GB300芯片。</p></blockquote></p><p></body></html></p><p><blockquote></blockquote></p><p></p>","source":"lsy1724652185079","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Production Hurdles for Nvidia's GB200 Spark Rumors of Microsoft Cutting Orders<blockquote>英伟达GB200的生产障碍引发微软削减订单的传言</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nProduction Hurdles for Nvidia's GB200 Spark Rumors of Microsoft Cutting Orders<blockquote>英伟达GB200的生产障碍引发微软削减订单的传言</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">Trend Force</strong><span class=\"h-time small\">2024-12-03 14:13</span>\n</p>\n</h4>\n</header>\n<article>\n<p><html><head></head><body>As demand for artificial intelligence continues to surge, the industry’s appetite for high-performance computing chips has grown increasingly intense. According to a report by the Commercial Times, NVIDIA’s next-generation Blackwell architecture chip, the GB200, has encountered new technical hurdles in its mass production plans. In response, CSP provider Microsoft is reportedly scaling back its orders.</p><p><blockquote><html><head></head><body>随着人工智能需求的不断激增，业界对高性能计算芯片的胃口也愈发强烈。据商业时报报道，英伟达下一代Blackwell架构芯片GB200在量产计划中遇到了新的技术障碍。据报道，作为回应，CSP提供商微软正在缩减订单。</body></html></blockquote></p><p><p class=\"t-img-caption\"><img src=\"https://community-static.tradeup.com/news/1d68eeb02c6b163c51fbae9253b663f6\" alt=\"NVIDIA Blackwell\" title=\"NVIDIA Blackwell\" tg-width=\"624\" tg-height=\"351\"/><span>NVIDIA Blackwell</span></p><p><blockquote><p class=\"t-img-caption\"><span>英伟达布莱克威尔</span></p></blockquote></p><p><p style=\"text-align: left;\">Sources within the supply chain cited by Commercial Times reveal that the issue lies in the backplane connection design. The testing yield for cartridge connectors provided by U.S. Tier-1 supplier Amphenol has been suboptimal, potentially delaying mass production until March 2025.</p><p><blockquote><p style=\"text-align: left;\">《商业时报》援引供应链内部的消息人士透露，问题出在背板连接设计上。美国一级供应商Amphenol提供的盒式连接器的测试产量一直不理想，可能会将大规模生产推迟到2025年3月。</p></blockquote></p><p><p style=\"text-align: left;\">The GB200 chips employ TSMC’s cutting-edge CoWoS-L advanced packaging technology, incorporating a highly complex cabinet design. However, this complexity has led to various challenges, including overheating in chip design, leakage issues in UQDs, and now, insufficient yield rates for copper cables. While NVIDIA announced during its recent earnings call that Blackwell production is fully underway, supply constraints remain a pressing issue that the company is working to resolve with its partners.</p><p><blockquote><p style=\"text-align: left;\">GB200芯片采用台积电尖端的CoWoS-L先进封装技术，结合了高度复杂的机柜设计。然而，这种复杂性导致了各种挑战，包括芯片设计中的过热、UQD中的泄漏问题，以及现在铜电缆的成品率不足。尽管英伟达在最近的财报看涨期权上宣布Blackwell的生产已全面展开，但供应限制仍然是该公司正在与合作伙伴努力解决的紧迫问题。</p></blockquote></p><p><p style=\"text-align: left;\">The same report, citing supply chain sources, attributes the issue to a newly developed cartridge connector module. The significant specification upgrade of the GB200 has increased production complexity, resulting in poor yield rates and failed testing, creating a major bottleneck.</p><p><blockquote><p style=\"text-align: left;\">同一份报告援引供应链消息来源，将问题归因于新开发的盒式连接器模块。GB200的重大规格升级增加了生产复杂性，导致良品率不佳和测试失败，形成了一个主要瓶颈。</p></blockquote></p><p><p style=\"text-align: left;\">NVIDIA is actively seeking alternative suppliers, but issues such as patent restrictions and capacity ramp-up delays are expected to prolong resolution efforts. While the report notes that chip production schedules remain unaffected, supply chain checks indicate that Microsoft has already cut its orders for NVIDIA by 40%, reallocating some to the GB300 chips set for release in mid-2025.</p><p><blockquote><p style=\"text-align: left;\">英伟达正在积极寻求替代供应商，但专利限制和产能提升延迟等问题预计将延长解决工作。虽然报告指出芯片生产计划仍未受到影响，但供应链检查表明，微软已经将NVIDIA的订单削减了40%，将部分订单重新分配给定于2025年中期发布的GB300芯片。</p></blockquote></p><p></body></html></p><p><blockquote></blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.trendforce.com/news/2024/12/02/news-production-hurdles-for-gb200-spark-rumors-of-microsoft-cutting-orders/\">Trend Force</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"NVDA":"英伟达"},"source_url":"https://www.trendforce.com/news/2024/12/02/news-production-hurdles-for-gb200-spark-rumors-of-microsoft-cutting-orders/","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1144849219","content_text":"As demand for artificial intelligence continues to surge, the industry’s appetite for high-performance computing chips has grown increasingly intense. According to a report by the Commercial Times, NVIDIA’s next-generation Blackwell architecture chip, the GB200, has encountered new technical hurdles in its mass production plans. In response, CSP provider Microsoft is reportedly scaling back its orders.NVIDIA BlackwellSources within the supply chain cited by Commercial Times reveal that the issue lies in the backplane connection design. The testing yield for cartridge connectors provided by U.S. Tier-1 supplier Amphenol has been suboptimal, potentially delaying mass production until March 2025.The GB200 chips employ TSMC’s cutting-edge CoWoS-L advanced packaging technology, incorporating a highly complex cabinet design. However, this complexity has led to various challenges, including overheating in chip design, leakage issues in UQDs, and now, insufficient yield rates for copper cables. While NVIDIA announced during its recent earnings call that Blackwell production is fully underway, supply constraints remain a pressing issue that the company is working to resolve with its partners.The same report, citing supply chain sources, attributes the issue to a newly developed cartridge connector module. The significant specification upgrade of the GB200 has increased production complexity, resulting in poor yield rates and failed testing, creating a major bottleneck.NVIDIA is actively seeking alternative suppliers, but issues such as patent restrictions and capacity ramp-up delays are expected to prolong resolution efforts. While the report notes that chip production schedules remain unaffected, supply chain checks indicate that Microsoft has already cut its orders for NVIDIA by 40%, reallocating some to the GB300 chips set for release in mid-2025.","news_type":1,"symbols_score_info":{"NVDA":1.1}},"isVote":1,"tweetType":1,"viewCount":2469,"commentLimit":10,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"symbols":[],"verified":2,"subType":0,"readableState":1,"langContent":"CN","currentLanguage":"CN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":15,"xxTargetLangEnum":"ZH_CN"},"commentList":[],"isCommentEnd":true,"isTiger":false,"isWeiXinMini":false,"url":"/m/post/377582809596008"}
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