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台积电准备新一代CoPoS封装技术：最快2028年末量产，英伟达或是首个客户

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src=\"http://n.sinaimg.cn/spider20250612/232/w660h372/20250612/d3dd-f30fd965c11738d6ddbb79f0cd1713b0.jpg\"/><span></span></div><p cms-style=\"font-L\">台积电计划2026年建造一条CoPoS试点生产线，2027年将重点改进工艺，以便满足合作伙伴的要求。台积电计划2028年年底至2029年年初实现CoPoS的量产工作，位于中国台湾嘉义的AP7工厂由于现代化的基础设施和宽敞的空间而被选中，成为CoPoS先进封装技术的生产中心。</p><p cms-style=\"font-L\">与FOPLP（扇出型面板级封装）一样，CoPoS（基板上面板芯片封装）也采用大型面板基板进行封装，不过两者存在一些差异。FOPLP是一种不需要中介层的封装方法，芯片直接重新分布在面板基板上，并通过重分布层（RDL）互连。这种方法具有成本低、I/O密度高、外形尺寸灵活等优势，适用于边缘AI、移动设备和集成密度适中的中端ASIC等应用。CoPoS则引入了中介层，从而有着更高的信号完整性和稳定的功率传输，对于集成GPU和HBM芯片的高端产品来说效果更好。同时中介层材料正从传统的硅变为玻璃，将提供更高的成本效益和热稳定性。</p><p cms-style=\"font-L\">预计<a href=\"https://laohu8.com/S/600532\">未来</a>CoPoS将取代CoWoS-L，而英伟达很可能会是首个合作伙伴。</p>\n<div></div>\n<div>\n<div><img src=\"\"/></div>\n<div>海量资讯、精准解读，尽在<a href=\"https://laohu8.com/S/SINA\">新浪</a>财经APP</div>\n</div>\n</div></body></html>","source":"sina","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta 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href=https://finance.sina.com.cn/stock/t/2025-06-12/doc-inezvcxy3617463.shtml><strong>市场资讯</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 近年来，台积电（TSMC）除了积极投资先进制程节点，以保证竞争优势外，还逐步加大了在封装技术方面的投入力度，以满足新一代人工智能（AI）和高性能计算（HPC）芯片的需求。英伟达首席执行官黄仁勋曾表示，台积电可以提供非常先进的封装技术，暂时没有其他选择。据TECHPOWERUP报道，台积电正在准备新一代CoPoS（Chip-...</p>\n\n<a href=\"https://finance.sina.com.cn/stock/t/2025-06-12/doc-inezvcxy3617463.shtml\">Web Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"BK4551":"寇图资本持仓","NVDY":"YIELDMAX NVDA OPTION INCOME STRATEGY ETF","IE00BK4W5L77.USD":"HSBC GLOBAL FUNDS ICAV US EQUITY INDEX \"HC\" (USD) ACC","LU1282649810.SGD":"Allianz Asian Multi Income Plus Cl AMg DIS H2-SGD","LU0096362180.USD":"CT (LUX) I GLOBAL FOCUS \"DU\" (USD)","LU2452424414.USD":"BGF ESG MULTI-ASSET \"A10\" (USDHDG) INC","NVD":"GraniteShares 2x Short NVDA Daily ETF","2NVD.UK":"2X NVIDIA ETP","NVD2.UK":"2X NVIDIA 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