只进不出当存钱
11-17
$英特尔(INTC)$
都出利好了 还不涨 是不是涨不动了
[财迷]
台积电不再是唯一：苹果、高通评估Intel先进封装替代
免责声明：上述内容仅代表发帖人个人观点，不构成本平台的任何投资建议。
分享至
微信
复制链接
精彩评论
博諺國際控股
11-17
博諺國際控股
这种也叫利好？搞笑。所谓利好啊大资金投资占股才叫利好 实实在在的利好 你这种新闻也就坑散户罢了
什么也没有了～
APP内打开
发表看法
1
3
{"i18n":{"language":"zh_CN"},"detailType":1,"isChannel":false,"data":{"magic":2,"id":501193026626336,"tweetId":"501193026626336","gmtCreate":1763391861303,"gmtModify":1763391863913,"author":{"id":3476767279618925,"idStr":"3476767279618925","authorId":3476767279618925,"authorIdStr":"3476767279618925","name":"只进不出当存钱","avatar":"https://static.tigerbbs.com/a21a7975b5b2b477a8623835b9ab875c","vip":1,"userType":1,"introduction":"","boolIsFan":false,"boolIsHead":false,"crmLevel":4,"crmLevelSwitch":0,"currentWearingBadge":{"badgeId":"e50ce593bb40487ebfb542ca54f6a561-4","templateUuid":"e50ce593bb40487ebfb542ca54f6a561","name":"明星虎友","description":"加入老虎社区2000天","bigImgUrl":"https://static.tigerbbs.com/dddf24b906c7011de2617d4fb3f76987","smallImgUrl":"https://static.tigerbbs.com/53d58ad32c97254c6f74db8b97e6ec49","grayImgUrl":"https://static.tigerbbs.com/6304700d92ad91c7a33e2e92ec32ecc1","redirectLinkEnabled":0,"hasAllocated":1,"isWearing":1,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2023.06.12","individualDisplayEnabled":0},"individualDisplayBadges":[],"fanSize":97,"starInvestorFlag":false},"themes":[],"images":[],"coverImages":[],"title":"","html":"<html><head></head><body><a href=\"https://laohu8.com/S/INTC\">$英特尔(INTC)$ </a> 都出利好了 还不涨 是不是涨不动了<span>[财迷] </span> </body></html>","htmlText":"<html><head></head><body><a href=\"https://laohu8.com/S/INTC\">$英特尔(INTC)$ </a> 都出利好了 还不涨 是不是涨不动了<span>[财迷] </span> </body></html>","text":"$英特尔(INTC)$ 都出利好了 还不涨 是不是涨不动了[财迷]","highlighted":1,"essential":1,"paper":1,"likeSize":3,"commentSize":1,"repostSize":0,"favoriteSize":0,"link":"https://laohu8.com/post/501193026626336","repostId":2584643350,"repostType":2,"repost":{"id":"2584643350","kind":"news","pubTimestamp":1763368416,"share":"https://www.laohu8.com/m/news/2584643350?lang=&edition=full","pubTime":"2025-11-17 16:33","market":"us","language":"zh","title":"台积电不再是唯一：苹果、高通评估Intel先进封装替代","url":"https://stock-news.laohu8.com/highlight/detail?id=2584643350","media":"快科技","summary":"同时，高通资料中心事业部的产品管理主管职缺，也将Intel EMIB列为一项重要的专业技能。市场人士指出，苹果和高通此次明确点名Intel技术，被视为产业开始走向多元化布局的信号，也预示着未来先进封装可能从单一依赖CoWoS，逐渐走向“双供应模式”。","content":"<html><body><article><p>快科技11月17日消息，随着全球对AI和高性能计算芯片需求的增长，先进封装技术的需求持续升温，市场对<a href=\"https://laohu8.com/S/TSM\">台积电</a>CoWoS产线的依赖也达到了高峰。</p><p>由于台积电的CoWoS产能目前主要被NVIDIA、<a href=\"https://laohu8.com/S/AMD\">AMD</a>以及大型云端客户承包，留给新客户的排程弹性和空间非常有限。</p><p>这使得其他芯片大厂不得不开始积极评估并布局多元化的封装路线，<strong>包括<a href=\"https://laohu8.com/S/AAPL\">苹果</a>和<a href=\"https://laohu8.com/S/QCOM\">高通</a>在内的多家科技巨头，正积极在其新招聘的职缺中明确要求具备Intel EMIB和Foveros等封装技术的经验。</strong></p><img src=\"https://fid-75186.picgzc.qpic.cn/20251117163723644d2064khoh8y8zyq\"/><p>苹果公司正在招聘DRAM封装工程师，其技能要求中明确列出了对CoWoS、EMIB、SoIC以及PoP等多种先进封装技术的熟悉程度。</p><img src=\"https://fid-75186.picgzc.qpic.cn/20251117163724708d206f3zyzb7dwws\"/><p><strong>同时，高通资料中心事业部的产品管理主管职缺，也将Intel EMIB列为一项重要的专业技能。</strong></p><p>Intel CEO及高层过去曾多次强调，自家的Foveros和EMIB技术已吸引了多家客户的兴趣，并具备大规模量产的能力。</p><img src=\"https://fid-75186.picgzc.qpic.cn/20251117163734248d2064fwdjnhdh7o\"/><p>其中EMIB属于2.5D封装，采用嵌入式硅桥连接多颗芯片，实现水平整合，无需大型硅中介层，具备成本较低和散热优良的优点。</p><p><strong>Foveros属于3D垂直堆叠封装，通过硅通孔（TSV）进行异质垂直堆叠，适合混合不同制程的芯片，具有高密度和省电的特性，</strong>Meteor Lake、Arrow Lake与Lunar Lake均采用了此项技术。</p><p>而台积电的CoWoS则属于2.5D大型硅中介层封装，是目前支持最多颗HBM堆叠的解决方案，也是AI GPU最主要采用的市场主流技术，优势在于成熟度高、产线规模大。</p><p>市场人士指出，苹果和高通此次明确点名Intel技术，被视为产业开始走向多元化布局的信号，也预示着未来先进封装可能从单一依赖CoWoS，逐渐走向“双供应模式”。</p><img src=\"https://fid-75186.picgzc.qpic.cn/20251117163734925d20686a0l612i32\"/></article></body></html>","source":"tencent","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>台积电不再是唯一：苹果、高通评估Intel先进封装替代</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n台积电不再是唯一：苹果、高通评估Intel先进封装替代\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-11-17 16:33 北京时间 <a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251117163738a6fee860&s=b><strong>快科技</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>快科技11月17日消息，随着全球对AI和高性能计算芯片需求的增长，先进封装技术的需求持续升温，市场对台积电CoWoS产线的依赖也达到了高峰。由于台积电的CoWoS产能目前主要被NVIDIA、AMD以及大型云端客户承包，留给新客户的排程弹性和空间非常有限。这使得其他芯片大厂不得不开始积极评估并布局多元化的封装路线，包括苹果和高通在内的多家科技巨头，正积极在其新招聘的职缺中明确要求具备Intel ...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251117163738a6fee860&s=b\">Web Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"SG9999002232.USD":"Allianz Global High Payout USD","SG9999015952.SGD":"LIONGLOBAL DISRUPTIVE INNOVATION \"I\" (SGD) ACC","LU0912757837.SGD":"JPMorgan Investment Funds - Global Income A (mth) SGD-H","LU0417517546.SGD":"Allianz US Equity Cl AT Acc SGD","MACW.SI":"APPLE 3xLongSG261006","QCOM":"高通","03145":"华夏亚洲高息股","IE00BJLML261.HKD":"HSBC GLOBAL EQUITY INDEX \"HCH\" (HKD) ACC","LU1582987597.SGD":"M&G (LUX) INCOME ALLOCATION \"A-H\" (SGDHDG) INC","LU2294711713.HKD":"BNP PARIBAS ENERGY TRANSITION \"C\" (HKD) ACC","INTC":"英特尔","LU1551013342.USD":"Allianz Income and Growth Cl AMg2 DIS USD","LU2452424414.USD":"BGF ESG MULTI-ASSET \"A10\" (USDHDG) INC","LU2471134879.HKD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (HKD) INC","LU2286300806.USD":"Allianz Cyber Security AT Acc USD","BK4554":"元宇宙及AR概念","IE00BVYPNQ40.USD":"GUINNESS ASIAN EQUITY INCOME \"C\" (USD) ACC","LU0957791311.USD":"THREADNEEDLE (LUX) GLOBAL FOCUS \"ZU\" (USD) ACC","LU2381873111.SGD":"BGF SYSTEMATIC GLOBAL EQUITY HIGH INCOME \"A6\" (SGDHDG) INC","LU0048584097.USD":"FIDELITY FUNDS GLOBAL THEMATIC OPPORTUNITIES \"A\" (USD) INC","LU0289739343.SGD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (SGD) ACC","LU0466842654.USD":"HSBC ISLAMIC GLOBAL EQUITY INDEX \"A\" (USD) ACC","TSM":"台积电","LU0964807845.USD":"ALLIANZ INCOME & GROWTH \"A\" (USD) INC","IE00B5TLWC47.USD":"BNY MELLON LONG-TERM GLOBAL EQUITY \"B\" (USD) ACC","LU2860962120.EUR":"CPR INVEST - ARTIFICIAL INTELLIGENCE \"A2\" (EUR) ACC A","LU2471134796.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) INC","BK4585":"ETF&股票定投概念","IE0003U64NQ7.SGD":"PIMCO BALANCED INCOME AND GROWTH \"M\" (SGDHDG) ACC","LU2247934214.USD":"FIDELITY FUNDS SUSTAINABLE FUTURE CONNECTIVITY \"A\" (USD) ACC","IE00BFSS7M15.SGD":"Janus Henderson Balanced A Acc SGD-H","LU2028103732.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"AMG\" (USD) INC","LU1069344957.HKD":"AB SICAV I - AMERICAN GROWTH PORTFOLIO \"AD\" (HKD) INC","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","LU2750360997.AUD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (AUDHDG) INC","LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","LU2023250843.SGD":"Allianz Thematica Cl AT Acc H2-SGD","IE00BZ1G4Q59.USD":"LEGG MASON CLEARBRIDGE US EQUITY SUSTAINABILITY LEADER \"A\"(USD) INC (A)","AAPL":"苹果","LU2602419157.SGD":"HSBC ISLAMIC GLOBAL EQUITY INDEX \"AC\" (SGD) ACC","LU1989772840.SGD":"CPR Invest - Climate Action A2 Acc SGD-H","LU1242518931.SGD":"Fullerton Lux Funds - Asia Absolute Alpha A Acc SGD","BK4612":"AI芯片","LU2756315318.SGD":"ALLIANZ INCOME AND GROWTH \"AMG\" (SGDHDG) INC A","BK4559":"巴菲特持仓","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","LU0979878070.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"A\" (USD) ACC","BK4579":"人工智能","LU2487616109.SGD":"JPM AMERICA EQUITY \"A\" (SGD) ACC","IE0004086264.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"A\" (USD) ACC"},"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251117163738a6fee860&s=b","is_english":false,"share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","article_id":"2584643350","content_text":"快科技11月17日消息，随着全球对AI和高性能计算芯片需求的增长，先进封装技术的需求持续升温，市场对台积电CoWoS产线的依赖也达到了高峰。由于台积电的CoWoS产能目前主要被NVIDIA、AMD以及大型云端客户承包，留给新客户的排程弹性和空间非常有限。这使得其他芯片大厂不得不开始积极评估并布局多元化的封装路线，包括苹果和高通在内的多家科技巨头，正积极在其新招聘的职缺中明确要求具备Intel EMIB和Foveros等封装技术的经验。苹果公司正在招聘DRAM封装工程师，其技能要求中明确列出了对CoWoS、EMIB、SoIC以及PoP等多种先进封装技术的熟悉程度。同时，高通资料中心事业部的产品管理主管职缺，也将Intel EMIB列为一项重要的专业技能。Intel CEO及高层过去曾多次强调，自家的Foveros和EMIB技术已吸引了多家客户的兴趣，并具备大规模量产的能力。其中EMIB属于2.5D封装，采用嵌入式硅桥连接多颗芯片，实现水平整合，无需大型硅中介层，具备成本较低和散热优良的优点。Foveros属于3D垂直堆叠封装，通过硅通孔（TSV）进行异质垂直堆叠，适合混合不同制程的芯片，具有高密度和省电的特性，Meteor Lake、Arrow Lake与Lunar Lake均采用了此项技术。而台积电的CoWoS则属于2.5D大型硅中介层封装，是目前支持最多颗HBM堆叠的解决方案，也是AI GPU最主要采用的市场主流技术，优势在于成熟度高、产线规模大。市场人士指出，苹果和高通此次明确点名Intel技术，被视为产业开始走向多元化布局的信号，也预示着未来先进封装可能从单一依赖CoWoS，逐渐走向“双供应模式”。","news_type":1,"symbols_score_info":{"INTC":1.5,"03145":0.6,"TSM":1.5,"QCOM":1.5,"AAPL":1.5,"MACW.SI":0.6}},"isVote":1,"tweetType":1,"viewCount":773,"commentLimit":10,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"symbols":["INTC"],"verified":2,"subType":0,"readableState":1,"langContent":"CN","currentLanguage":"CN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":50,"optionInvolvedFlag":false,"xxTargetLangEnum":"ZH_CN"},"commentList":[{"id":501201905770912,"commentId":"501201905770912","gmtCreate":1763394110311,"gmtModify":1763394113924,"authorId":3576321177589538,"author":{"id":3576321177589538,"idStr":"3576321177589538","authorId":3576321177589538,"name":"博諺國際控股","avatar":"https://static.tigerbbs.com/83f2570c212c3478418731d5e5f32d87","vip":1,"hat":"https://static.tigerbbs.com/0a8758340a08196056f8bc1e54805193","crmLevel":6,"crmLevelSwitch":1,"individualDisplayBadges":[]},"repliedAuthorId":0,"objectId":501193026626336,"objectIdStr":"501193026626336","type":1,"supId":0,"supIdStr":"0","prevId":0,"prevIdStr":"0","content":"这种也叫利好？搞笑。所谓利好啊大资金投资占股才叫利好 实实在在的利好 你这种新闻也就坑散户罢了","text":"这种也叫利好？搞笑。所谓利好啊大资金投资占股才叫利好 实实在在的利好 你这种新闻也就坑散户罢了","html":"这种也叫利好？搞笑。所谓利好啊大资金投资占股才叫利好 实实在在的利好 你这种新闻也就坑散户罢了","likeSize":0,"commentSize":0,"subComments":[],"verified":10,"allocateAmount":0,"commentType":"valid","coins":0,"score":0,"disclaimerType":0}],"isCommentEnd":false,"isTiger":false,"isWeiXinMini":false,"url":"/m/post/501193026626336"}
精彩评论