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{"i18n":{"language":"zh_CN"},"detailType":1,"isChannel":false,"data":{"magic":2,"id":501329055797960,"tweetId":"501329055797960","gmtCreate":1763424663121,"gmtModify":1763429765960,"author":{"id":4225598116905692,"idStr":"4225598116905692","authorId":4225598116905692,"authorIdStr":"4225598116905692","name":"RicardoWEN","avatar":"https://community-static.tradeup.com/news/default-avatar.jpg","vip":1,"userType":1,"introduction":"","boolIsFan":false,"boolIsHead":false,"crmLevel":11,"crmLevelSwitch":0,"individualDisplayBadges":[],"fanSize":0,"starInvestorFlag":false},"themes":[],"images":[],"coverImages":[],"title":"","html":"<html><head></head><body>这篇文章不错，转发给大家看看</body></html>","htmlText":"<html><head></head><body>这篇文章不错，转发给大家看看</body></html>","text":"这篇文章不错，转发给大家看看","highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"favoriteSize":0,"link":"https://laohu8.com/post/501329055797960","repostId":2584675878,"repostType":2,"repost":{"id":"2584675878","kind":"news","pubTimestamp":1763386416,"share":"https://www.laohu8.com/m/news/2584675878?lang=zh_CN&edition=full","pubTime":"2025-11-17 21:33","market":"us","language":"zh","title":"光学共封装（CPO）真的来了？台积电首批样品即将交付","url":"https://stock-news.laohu8.com/highlight/detail?id=2584675878","media":"半导体芯知","summary":"为此，光学共封装 技术成为下一代高性能计算和高速互连的核心解决方案。根据最新相关报道，台积电 已开发出首批 CPO 样片，并预计将在年内交付到NVIDIA（英伟达）和Broadcom（博通）。业内预计，这批 1.6T光模块最早将于 2026 年开始出货。TSMC的硅光子技术与先进封装方案的结合，使得CPO模块能够在晶圆级实现高密度集成，同时保持良好的批量复制性和一致性。","content":"<html><body><article><p>正如笔者前几天所提及的，随着AI数据中心对带宽和能效需求的持续爆发，传统铜线互连架构逐渐遇到物理瓶颈。为此，光学共封装（CPO, Co-Packaged Optics） 技术成为下一代高性能计算和高速互连的核心解决方案。</p><p>根据最新相关报道，<a href=\"https://laohu8.com/S/TSM\">台积电</a>（TSMC）已开发出首批 CPO 样片，并预计将在年内交付到NVIDIA（<a href=\"https://laohu8.com/S/NVDA\">英伟达</a>）和Broadcom（<a href=\"https://laohu8.com/S/AVGO\">博通</a>）。这些样片支持每条光纤高达1.6T（Terabits-per-second）的传输速率，可直接应用于新一代 AI 数据中心，实现芯片间光互连的高速通信。业内预计，这批 1.6T光模块最早将于 2026 年开始<span>出货</span>。</p><img src=\"https://fid-75186.picgzc.qpic.cn/20251118020153043v1525nty5cxqhxx\"/><p>（1）CPO 技术为何成为 AI 数据中心新宠？</p><p>CPO（Co-Packaged Optics，光学共封装）的核心理念，是将光模块直接与主芯片共封装，使电-光信号转换在毫米级距离内完成，从而最大化带宽利用率，同时显著降低功耗和信号延迟。这一设计彻底突破了传统铜线互连在高带宽、高密度应用中的物理限制，使芯片间通信速度和能效实现同步提升。相比传统的分离式封装，CPO在数据传输密度、能效比和系统可靠性方面均有显著优势，尤其适合用于AI模型训练平台、高性能交换机和下一代数据中心的核心计算节点。</p><p>TSMC的硅光子技术与先进封装方案的结合，使得CPO模块能够在晶圆级实现高密度集成，同时保持良好的批量复制性和一致性。这意味着，不仅单个芯片的性能大幅提升，整个数据中心在规模化部署时也能获得稳定可靠的光互连方案。值得注意的是，晶圆级的<a href=\"https://laohu8.com/S/600184\">光电</a>集成还能有效降低布线复杂度，简化散热管理，同时为大规模并行计算提供可扩展的解决方案。未来，随着CPO技术不断成熟，其在 AI 数据中心、云计算服务器和高速互联网络中的应用将更加广泛，有望成为下一代高性能计算的标准方案，为算力升级和能效优化提供核心支撑。</p><p>（2）行业意义与展望</p><p>CPO技术的价值不仅体现在技术层面，更直接影响整个高性能计算生态。对于AI推理和训练负载持续攀升的数据中心而言，CPO可突破铜线互连的速度与能效瓶颈，实现芯片间光互连的质的飞跃。若这批1.6T光模块当真在2026年开始量产，AI数据中心将进入“光速时代”，算力密度、能效比和整体性能都将获得显著提升。</p><p>此外，TSMC的硅光子技术结合先进封装方案，也将推动光通信、交换机、高性能服务器等相关产业的发展。有业内分析师认为，随着CPO技术逐步成熟并进入量产阶段，它有望成为下一代数据中心的标准方案，不仅提升算力和能效，还将推动全球 AI 计算能力的升级，为云计算、大模型训练和高性能计算应用带来全新机遇。</p></article></body></html>","source":"tencent","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; 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overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n光学共封装（CPO）真的来了？台积电首批样品即将交付\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-11-17 21:33 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251118020213a6ffe6d2&s=b><strong>半导体芯知</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>正如笔者前几天所提及的，随着AI数据中心对带宽和能效需求的持续爆发，传统铜线互连架构逐渐遇到物理瓶颈。为此，光学共封装（CPO, Co-Packaged Optics） 技术成为下一代高性能计算和高速互连的核心解决方案。根据最新相关报道，台积电（TSMC）已开发出首批 CPO 样片，并预计将在年内交付到NVIDIA（英伟达）和Broadcom（博通）。这些样片支持每条光纤高达1.6T（...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251118020213a6ffe6d2&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","LU0965509010.AUD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (AUDHDG) INC","LU2023251221.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (USD) INC","LU2111349929.HKD":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (HKD) INC","LU1508157978.USD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOLUTE RETURN \"A\" (USD) ACC","LU2211814178.USD":"ALLIANZ 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样片，并预计将在年内交付到NVIDIA（英伟达）和Broadcom（博通）。这些样片支持每条光纤高达1.6T（Terabits-per-second）的传输速率，可直接应用于新一代 AI 数据中心，实现芯片间光互连的高速通信。业内预计，这批 1.6T光模块最早将于 2026 年开始出货。（1）CPO 技术为何成为 AI 数据中心新宠？CPO（Co-Packaged Optics，光学共封装）的核心理念，是将光模块直接与主芯片共封装，使电-光信号转换在毫米级距离内完成，从而最大化带宽利用率，同时显著降低功耗和信号延迟。这一设计彻底突破了传统铜线互连在高带宽、高密度应用中的物理限制，使芯片间通信速度和能效实现同步提升。相比传统的分离式封装，CPO在数据传输密度、能效比和系统可靠性方面均有显著优势，尤其适合用于AI模型训练平台、高性能交换机和下一代数据中心的核心计算节点。TSMC的硅光子技术与先进封装方案的结合，使得CPO模块能够在晶圆级实现高密度集成，同时保持良好的批量复制性和一致性。这意味着，不仅单个芯片的性能大幅提升，整个数据中心在规模化部署时也能获得稳定可靠的光互连方案。值得注意的是，晶圆级的光电集成还能有效降低布线复杂度，简化散热管理，同时为大规模并行计算提供可扩展的解决方案。未来，随着CPO技术不断成熟，其在 AI 数据中心、云计算服务器和高速互联网络中的应用将更加广泛，有望成为下一代高性能计算的标准方案，为算力升级和能效优化提供核心支撑。（2）行业意义与展望CPO技术的价值不仅体现在技术层面，更直接影响整个高性能计算生态。对于AI推理和训练负载持续攀升的数据中心而言，CPO可突破铜线互连的速度与能效瓶颈，实现芯片间光互连的质的飞跃。若这批1.6T光模块当真在2026年开始量产，AI数据中心将进入“光速时代”，算力密度、能效比和整体性能都将获得显著提升。此外，TSMC的硅光子技术结合先进封装方案，也将推动光通信、交换机、高性能服务器等相关产业的发展。有业内分析师认为，随着CPO技术逐步成熟并进入量产阶段，它有望成为下一代数据中心的标准方案，不仅提升算力和能效，还将推动全球 AI 计算能力的升级，为云计算、大模型训练和高性能计算应用带来全新机遇。","news_type":1,"symbols_score_info":{"NVDA":0.9,"03145":0.6,"TSM":1.5}},"isVote":1,"tweetType":1,"viewCount":267,"commentLimit":10,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"symbols":[],"verified":2,"subType":0,"readableState":1,"langContent":"CN","currentLanguage":"CN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":27,"optionInvolvedFlag":false,"xxTargetLangEnum":"ZH_CN"},"commentList":[],"isCommentEnd":true,"isTiger":false,"isWeiXinMini":false,"url":"/m/post/501329055797960"}