Q&A on AI demand: The questioner asks if HBM (High Bandwidth Memory) is more of a constraint on AI demand rather than COWA (Chip on Wafer on Substrate) capacity, which seems to be the bigger constraint currently. TSMC responds that they don't comment on other suppliers, but affirms they have very tight capacity to support AI-related demand. They are working hard with customers to meet requirements.
TSMC CFO Wendell Huang discussed Q4 2024 financial highlights and Q1 2025 guidance. Key points: 1. Q4 revenue increased 14.3% sequentially, with strong demand for 3nm and 5nm technologies. 2. Q1 2025 revenue expected to decline 5.5% sequentially due to smartphone seasonality, offset by AI demand growth. 3. Full year 2025 revenue forecast to increase by close to 20% in USD terms. 4. Capital budget for 2025 set at $38-42 billion to capture future growth opportunities. 5. AI-related demand remains robust, with AI accelerator revenue expected to double in 2025.
TSMC's global expansion strategy update: 1. US operations: Arizona fab entered high-volume production in Q4 2024 using advanced process technology, with yield comparable to Taiwan fabs. Plans for second and third Arizona fabs on track, utilizing even more advanced technologies like N3 and N2. 2. Japan: First specialty technology fab in Kumamoto started volume production in late 2024. Construction of second specialty fab to begin this year. 3. Europe: Progressing with plans to build specialty technology fab in Germany for automotive and industrial applications. 4. Taiwan: Expanding advanced te
TSMC's Global Manufacturing Update: 1. US: Arizona fab entered high-volume production in Q4 2024, using advanced process technology comparable to Taiwan fabs. Plans for second and third fabs in Arizona on track, utilizing more advanced technologies like N2 and A16. 2. Japan: First specialty fab in Kumamoto started volume production in late 2024. Construction of second fab to begin this year. 3. Europe: Progressing with plans to build specialty fab in Germany for automotive and industrial applications. 4. Taiwan: Expanding 3nm capacity in Tainan, preparing for 2nm fabs in Hsinchu and Kaohsiung