悟空的花果山
2024-12-30
苏姐的魅力，承认问题并知道改善就好，加仓
AMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应
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MichaelJack
2024-12-30
MichaelJack
越是常识，越是事实。跟进
马虎恶魔号
2024-12-30
马虎恶魔号
苏妈苏妈苏妈
什么也没有了～
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19:00","market":"us","language":"zh","title":"AMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应","url":"https://stock-news.laohu8.com/highlight/detail?id=2494156213","media":"芯界研习社","summary":"AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。SemiAnalysis指出，MI300X难以突破NVIDIA的“CUDA护城河”，这使得其在与NVIDIA的竞争中处于不利地位。MI300X需要大量调试才能使用，SemiAnalysis的研究表明，MI300X在未经大量调试的情况下几乎无法进行AI模型训练。SemiAnalysis对AMD MI300X的性能缺陷进行了全面分析，指出其软件层面的问题是主要瓶颈。","content":"<html><body><article><p>AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。近日，芯片顾问机构Semianalysis的报告称，花了五个月时间才弄清AMD的AI芯片 MI300X ，理论上，MI300X 在规格和总拥有成本 (TCO) 方面应该比 Nvidia 的 H100 和 H200 具有巨大优势，然而，实际情况是，该芯片的实际性能未达预期。</p><img src=\"https://fid-75186.picgzc.qpic.cn/20241228190247406v206bmvskxoayyv\"/><p>SemiAnalysis指出，尽管MI300X在硬件配置上具有显著优势，如高达1307 TeraFLOPS的FP16精度算力和192GB的HBM3内存，但其软件层面的问题却使其难以发挥应有的性能。这些软件缺陷包括但不限于AI模型训练的复杂调试需求、开箱即用体验差以及环境变量的复杂性。</p><p>在开箱问题上，MI300X的开箱即用体验非常糟糕，用户需要投入大量时间和精力进行手动调试才能正常使用。相比之下，NVIDIA的CUDA技术提供了更高的稳定性和易用性，用户可以轻松上手并开展工作。</p><p>即便在硬件规格上优于竞争对手，如<a href=\"https://laohu8.com/S/NVDA\">英伟达</a>的H100和H200，MI300X的实际性能却未能达到市场预期。SemiAnalysis通过多项基准测试发现，MI300X在实际应用中表现不如理论值，特别是在AI模型训练过程中，性能受限于软件问题。</p><p>SemiAnalysis指出，MI300X难以突破NVIDIA的“CUDA护城河”，这使得其在与NVIDIA的竞争中处于不利地位。</p><p>MI300X需要大量调试才能使用，SemiAnalysis的研究表明，MI300X在未经大量调试的情况下几乎无法进行AI模型训练。这一问题导致用户在实际使用中面临诸多困难，进一步限制了其市场竞争力。</p><p>SemiAnalysis对AMD MI300X的性能缺陷进行了全面分析，指出其软件层面的问题是主要瓶颈。尽管硬件配置强大，但软件生态的不足使得MI300X难以在AI芯片市场中与NVIDIA竞争。</p><p>SemiAnalysis建议AMD增加对软件开发和测试的投入，特别是通过自动化测试和优化默认设置来简化环境变量，提升用户体验。此外，AMD需要学习NVIDIA的做法，持续推出新功能和工具库以巩固市场地位。</p><p>对此，AMD CEO苏姿丰表示，AMD非常感谢Semianalysis等机构提供的建设性反馈，并承认公司在软件开发和测试方面确实存在不足。为了改善这一状况，AMD已经投入大量资源进行优化，包括配置数千颗MI300X芯片进行全面的自动化测试，以简化复杂的环境变量并实现“开箱即用”的便捷性。</p><p>苏姿丰与Semianalysis首席分析师Dylan Patel进行了长达1.5小时的深入讨论，探讨了AMD在软件领域的不足及未来的改进方向。她坦言，尽管AMD在硬件性能上取得了显著进步，但在软件层面的优化和稳定性仍需加强。</p><p>苏姿丰表示，“感谢Dylan与我进行了具有建设性的对话。即便是批评性的反馈，也是一份宝贵的礼物。”她还提到，2025年AMD将推出多项涉及AI领域的重大计划，显示出公司对未来发展的信心和决心。</p><p>尽管AMD在硬件方面具有一定的优势，但软件生态系统的不完善仍然是制约其市场竞争力的关键因素。业界普遍认为，AI芯片不仅需要强大的硬件支持，更需要高质量的软件配合。只有通过改善软件体验，AMD才能在竞争激烈的AI芯片市场中崭露头角。</p><p>内容来源于电子工程专辑</p></article></body></html>","source":"tencent","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>AMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应</title>\n<style 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href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b\">Web Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"BK4554":"元宇宙及AR概念","LU0823421416.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) INC","LU1242518857.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"I\" (USD) ACC","BK4532":"文艺复兴科技持仓","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","GFS":"GLOBALFOUNDRIES Inc.","LU0390134368.USD":"FRANKLIN GLOBAL GROWTH \"A\" (USD) ACC","BK4512":"苹果概念","LU2098885051.SGD":"JPMorgan Funds - Multi-Manager Alternatives A (acc) SGD","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","NVDA":"英伟达","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU1880398471.USD":"AMUNDI FUNDS GLOBAL EQUITY \"A2\" (USD) ACC","LU1880398554.USD":"AMUNDI FUNDS GLOBAL EQUITY \"A2\" (USD) 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DISRUPTIVE TECHNOLOGY \"C\" (USD) ACC","LU2054465674.USD":"UBS (LUX) KEY SELEC SICAV DIGITAL TRANSFORMATION T \"P\" (USD) ACC","AMD":"美国超微公司"},"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b","is_english":false,"share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","article_id":"2494156213","content_text":"AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。近日，芯片顾问机构Semianalysis的报告称，花了五个月时间才弄清AMD的AI芯片 MI300X ，理论上，MI300X 在规格和总拥有成本 (TCO) 方面应该比 Nvidia 的 H100 和 H200 具有巨大优势，然而，实际情况是，该芯片的实际性能未达预期。SemiAnalysis指出，尽管MI300X在硬件配置上具有显著优势，如高达1307 TeraFLOPS的FP16精度算力和192GB的HBM3内存，但其软件层面的问题却使其难以发挥应有的性能。这些软件缺陷包括但不限于AI模型训练的复杂调试需求、开箱即用体验差以及环境变量的复杂性。在开箱问题上，MI300X的开箱即用体验非常糟糕，用户需要投入大量时间和精力进行手动调试才能正常使用。相比之下，NVIDIA的CUDA技术提供了更高的稳定性和易用性，用户可以轻松上手并开展工作。即便在硬件规格上优于竞争对手，如英伟达的H100和H200，MI300X的实际性能却未能达到市场预期。SemiAnalysis通过多项基准测试发现，MI300X在实际应用中表现不如理论值，特别是在AI模型训练过程中，性能受限于软件问题。SemiAnalysis指出，MI300X难以突破NVIDIA的“CUDA护城河”，这使得其在与NVIDIA的竞争中处于不利地位。MI300X需要大量调试才能使用，SemiAnalysis的研究表明，MI300X在未经大量调试的情况下几乎无法进行AI模型训练。这一问题导致用户在实际使用中面临诸多困难，进一步限制了其市场竞争力。SemiAnalysis对AMD MI300X的性能缺陷进行了全面分析，指出其软件层面的问题是主要瓶颈。尽管硬件配置强大，但软件生态的不足使得MI300X难以在AI芯片市场中与NVIDIA竞争。SemiAnalysis建议AMD增加对软件开发和测试的投入，特别是通过自动化测试和优化默认设置来简化环境变量，提升用户体验。此外，AMD需要学习NVIDIA的做法，持续推出新功能和工具库以巩固市场地位。对此，AMD CEO苏姿丰表示，AMD非常感谢Semianalysis等机构提供的建设性反馈，并承认公司在软件开发和测试方面确实存在不足。为了改善这一状况，AMD已经投入大量资源进行优化，包括配置数千颗MI300X芯片进行全面的自动化测试，以简化复杂的环境变量并实现“开箱即用”的便捷性。苏姿丰与Semianalysis首席分析师Dylan 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