咚咚锵12345
10-29
发新品就是利好！研发能力就是竞争力。技术再牛最终还得看订单，就盼着赶紧落地转化成实打实的业绩，给股价来点刺激！
@赛晶科技：
新品发布 | 1200V 1000A/1100A ED封装IGBT模块
免责声明：上述内容仅代表发帖人个人观点，不构成本平台的任何投资建议。
分享至
微信
复制链接
精彩评论
我们需要你的真知灼见来填补这片空白
打开APP，发表看法
APP内打开
发表看法
1
{"i18n":{"language":"zh_CN"},"detailType":1,"isChannel":false,"data":{"magic":2,"id":623592167700048,"tweetId":"623592167700048","gmtCreate":1793259388287,"gmtModify":1793259390425,"author":{"id":4231402755885050,"idStr":"4231402755885050","authorId":4231402755885050,"authorIdStr":"4231402755885050","name":"咚咚锵12345","avatar":"https://static.tigerbbs.com/default-avatar2.jpg","vip":1,"userType":1,"introduction":"","boolIsFan":false,"boolIsHead":false,"crmLevel":1,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[],"fanSize":0,"starInvestorFlag":false},"themes":[],"images":[],"coverImages":[],"title":"","html":"<html><head></head><body>发新品就是利好！研发能力就是竞争力。技术再牛最终还得看订单，就盼着赶紧落地转化成实打实的业绩，给股价来点刺激！\n<br></body></html>","htmlText":"<html><head></head><body>发新品就是利好！研发能力就是竞争力。技术再牛最终还得看订单，就盼着赶紧落地转化成实打实的业绩，给股价来点刺激！\n<br></body></html>","text":"发新品就是利好！研发能力就是竞争力。技术再牛最终还得看订单，就盼着赶紧落地转化成实打实的业绩，给股价来点刺激！","highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"favoriteSize":0,"link":"https://laohu8.com/post/623592167700048","repostId":621372687552736,"repostType":1,"repost":{"magic":2,"id":621372687552736,"tweetId":"621372687552736","gmtCreate":1792727991662,"gmtModify":1792728625468,"author":{"id":4090643442997990,"idStr":"4090643442997990","authorId":4090643442997990,"authorIdStr":"4090643442997990","name":"赛晶科技","avatar":"https://static.tigerbbs.com/c653366291f5e74ad5f6882b9cf2d8da","vip":5,"userType":5,"introduction":"功率半导体器件、前沿性电力电子技术，国际领先的创新研发型企业","boolIsFan":false,"boolIsHead":false,"crmLevel":1,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[],"fanSize":2921,"starInvestorFlag":false},"themes":[],"images":[{"img":"https://static.tigerbbs.com/cfc27e063468077b5c0d44ed7557037a"},{"img":"https://static.tigerbbs.com/84be19f5dee3ecaf21acd7cab0b3b9ec"}],"coverImages":[{"img":"https://static.tigerbbs.com/cfc27e063468077b5c0d44ed7557037a"}],"title":"新品发布 | 1200V 1000A/1100A ED封装IGBT模块","html":"<html><head></head><body><p>i23系列 1200V 1000A/1100A IGBT模块采用经典ED封装，超精细微沟槽栅技术下的i23芯片赋予模块超低损耗Eon+Eoff，1200V/1000A 产品搭配加强型Si3N4 绝缘陶瓷覆铜基板，有效增强了模块出流能力。1200V/1100A产品在此基础上增加Pinfin散热底板，实现最低最低热阻的同时进一步提升了出流能力，为大功率、高功率密度、高可靠性的光伏、储能和商用车领域带来全新的解决方案。</p>\n<p></p>\n<p>新品发布</p>\n<p> </p>\n<p>1200V 1000A/1100A ED封装IGBT模块 </p>\n<p></p>\n<p class=\"t-img-caption\" style=\"display: flex; flex-direction: column; align-items: center;\"><img src=\"https://static.tigerbbs.com/cfc27e063468077b5c0d44ed7557037a\"><img><span><br></span></p>\n<p><br></p>\n<p class=\"t-img-caption\" style=\"display: flex; flex-direction: column; align-items: center;\"><img src=\"https://static.tigerbbs.com/84be19f5dee3ecaf21acd7cab0b3b9ec\"><img><span><br></span></p>\n<p><br></p>\n<p>产品型号</p>\n<p>SISD1000ED120i23</p>\n<p>SISD1100ED120i23P</p>\n<p><br></p>\n<p>产品特点</p>\n<p>i23超低损耗微沟槽栅IGBT芯片组</p>\n<p>加强 Si3N4 绝缘陶瓷覆铜基板</p>\n<p>低热阻铜底板</p>\n<p>行业标准封装，低内部阻抗</p>\n<p>实现最低热阻的针柱散热底板</p>\n<p>可选择压接式信号引脚</p>\n<p><br></p>\n<p>应用领域</p>\n<p>光伏逆变器</p>\n<p>储能PCS</p>\n<p>商用车</p>\n<p>变频器</p>\n<p>电焊机</p>\n<p>UPS</p></body></html>","htmlText":"<html><head></head><body><p>i23系列 1200V 1000A/1100A IGBT模块采用经典ED封装，超精细微沟槽栅技术下的i23芯片赋予模块超低损耗Eon+Eoff，1200V/1000A 产品搭配加强型Si3N4 绝缘陶瓷覆铜基板，有效增强了模块出流能力。1200V/1100A产品在此基础上增加Pinfin散热底板，实现最低最低热阻的同时进一步提升了出流能力，为大功率、高功率密度、高可靠性的光伏、储能和商用车领域带来全新的解决方案。</p>\n<p></p>\n<p>新品发布</p>\n<p> </p>\n<p>1200V 1000A/1100A ED封装IGBT模块 </p>\n<p></p>\n<p class=\"t-img-caption\" style=\"display: flex; flex-direction: column; align-items: center;\"><img src=\"https://static.tigerbbs.com/cfc27e063468077b5c0d44ed7557037a\"><img><span><br></span></p>\n<p><br></p>\n<p class=\"t-img-caption\" style=\"display: flex; flex-direction: column; align-items: center;\"><img src=\"https://static.tigerbbs.com/84be19f5dee3ecaf21acd7cab0b3b9ec\"><img><span><br></span></p>\n<p><br></p>\n<p>产品型号</p>\n<p>SISD1000ED120i23</p>\n<p>SISD1100ED120i23P</p>\n<p><br></p>\n<p>产品特点</p>\n<p>i23超低损耗微沟槽栅IGBT芯片组</p>\n<p>加强 Si3N4 绝缘陶瓷覆铜基板</p>\n<p>低热阻铜底板</p>\n<p>行业标准封装，低内部阻抗</p>\n<p>实现最低热阻的针柱散热底板</p>\n<p>可选择压接式信号引脚</p>\n<p><br></p>\n<p>应用领域</p>\n<p>光伏逆变器</p>\n<p>储能PCS</p>\n<p>商用车</p>\n<p>变频器</p>\n<p>电焊机</p>\n<p>UPS</p></body></html>","text":"i23系列 1200V 1000A/1100A IGBT模块采用经典ED封装，超精细微沟槽栅技术下的i23芯片赋予模块超低损耗Eon+Eoff，1200V/1000A 产品搭配加强型Si3N4 绝缘陶瓷覆铜基板，有效增强了模块出流能力。1200V/1100A产品在此基础上增加Pinfin散热底板，实现最低最低热阻的同时进一步提升了出流能力，为大功率、高功率密度、高可靠性的光伏、储能和商用车领域带来全新的解决方案。 新品发布 1200V 1000A/1100A ED封装IGBT模块 产品型号 SISD1000ED120i23 SISD1100ED120i23P 产品特点 i23超低损耗微沟槽栅IGBT芯片组 加强 Si3N4 绝缘陶瓷覆铜基板 低热阻铜底板 行业标准封装，低内部阻抗 实现最低热阻的针柱散热底板 可选择压接式信号引脚 应用领域 光伏逆变器 储能PCS 商用车 变频器 电焊机 UPS","highlighted":1,"essential":1,"paper":2,"link":"https://laohu8.com/post/621372687552736","repostId":0,"isVote":1,"tweetType":1,"commentLimit":10,"symbols":["00580"],"verified":2,"subType":0,"readableState":1,"langContent":"CN","currentLanguage":"CN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":595,"optionInvolvedFlag":false,"subscribersOnly":false,"subscribersOnlyAccessible":false,"xxTargetLangEnum":"ZH_CN"},"isVote":1,"tweetType":1,"viewCount":15,"commentLimit":10,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"symbols":[],"verified":2,"subType":0,"readableState":1,"langContent":"CN","currentLanguage":"CN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":105,"optionInvolvedFlag":false,"subscribersOnly":false,"subscribersOnlyAccessible":false,"xxTargetLangEnum":"ZH_CN"},"commentList":[],"isCommentEnd":true,"isTiger":false,"isWeiXinMini":false,"url":"/m/post/623592167700048"}
精彩评论