Q&A on AI demand: The questioner asks if HBM (High Bandwidth Memory) is more of a constraint on AI demand rather than COWA (Chip on Wafer on Substrate) capacity, which seems to be the bigger constraint currently. TSMC responds that they don't comment on other suppliers, but affirms they have very tight capacity to support AI-related demand. They are working hard with customers to meet requirements._老虎社区_美港股上老虎

Q&A on AI demand: The questioner asks if HBM (High Bandwidth Memory) is more of a constraint on AI demand rather than COWA (Chip on Wafer on Substrate) capacity, which seems to be the bigger constraint currently. TSMC responds that they don't comment on other suppliers, but affirms they have very tight capacity to support AI-related demand. They are working hard with customers to meet requirements.

Earnings Call2025-01-16

Q&A on AI demand: The questioner asks if HBM (High Bandwidth Memory) is more of a constraint on AI demand rather than COWA (Chip on Wafer on Substrate) capacity, which seems to be the bigger constraint currently. TSMC responds that they don't comment on other suppliers, but affirms they have very tight capacity to support AI-related demand. They are working hard with customers to meet requirements.

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