据报阿斯麦(ASML)计划将芯片制造设备扩展至先进封装领域_老虎社区_美港股上老虎

据报阿斯麦(ASML)计划将芯片制造设备扩展至先进封装领域

金吾财讯03-02

金吾财讯 | 据媒体报道，阿斯麦(ASML)计划利用人工智能提高工具性能和生产速度，计划将芯片制造设备扩展至先进封装领域，计划研发工具以帮助将多个芯片拼接在一起。

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