天弘科技(CLS)盘前升近3% 将与AMD合作推出 “Helios” 机柜级AI平台_老虎社区_美港股上老虎

天弘科技(CLS)盘前升近3% 将与AMD合作推出 “Helios” 机柜级AI平台

金吾财讯03-16

金吾财讯 | 天弘科技(CLS)盘前股价上扬，暂升2.86%，报271美元。

消息面上，公司与AMD今日联合宣布，双方达成战略合作，将推出基于开放标准的全新 “Helios” 机柜级人工智能平台。此次合作将 AMD 在高性能计算与人工智能计算领域的领先优势，与 Celestica 在高端网络交换技术领域的专业实力深度融合。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

暂无评论

热议股票

7x24

全部

{"i18n":{"language":"zh_CN"},"data":{"share":"https://www.laohu8.com/m/news/2619463652?lang=zh_CN&edition=full","thumbnail":"https://static.szfiu.com/news/20210810/MGE2ZWRkM2ExNzliODFiMWYxODE0Mjk1MTc3MTQ2.jpg","is_english":false,"pubTime":"2026-03-16 20:33","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2619463652","market":"fut","top_or_hot":-1,"title":"天弘科技(CLS)盘前升近3% 将与AMD合作推出 “Helios” 机柜级AI平台","media":"金吾财讯","content":"<html><body><p>金吾财讯 | <a href=\"https://laohu8.com/S/CLS\">天弘科技</a>(CLS)盘前股价上扬，暂升2.86%，报271美元。</p><p>消息面上，公司与<a href=\"https://laohu8.com/S/AMD\">AMD</a>今日联合宣布，双方达成战略合作，将推出基于开放标准的全新 “Helios” 机柜级人工智能平台。此次合作将 AMD 在高性能计算与人工智能计算领域的领先优势，与 Celestica 在高端网络交换技术领域的专业实力深度融合。</p></body></html>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>天弘科技(CLS)盘前升近3% 将与AMD合作推出 “Helios” 机柜级AI平台</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n天弘科技(CLS)盘前升近3% 将与AMD合作推出 “Helios” 机柜级AI平台\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1086022552\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://static.tigerbbs.com/19a93586c3b023ec6ebfed568990555c);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">金吾财讯 </p>\n<p class=\"h-time\">2026-03-16 20:33</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<html><body><p>金吾财讯 | <a href=\"https://laohu8.com/S/CLS\">天弘科技</a>(CLS)盘前股价上扬，暂升2.86%，报271美元。</p><p>消息面上，公司与<a href=\"https://laohu8.com/S/AMD\">AMD</a>今日联合宣布，双方达成战略合作，将推出基于开放标准的全新 “Helios” 机柜级人工智能平台。此次合作将 AMD 在高性能计算与人工智能计算领域的领先优势，与 Celestica 在高端网络交换技术领域的专业实力深度融合。</p></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"IE00BMPRXR70.SGD","symbol_name":"Neuberger Berman 5G Connectivity A Acc SGD-H","start_time":0,"source_url":"298051","article_id":"2619463652","we_media_id":"1086022552","thumbnails":["https://static.szfiu.com/news/20210810/MGE2ZWRkM2ExNzliODFiMWYxODE0Mjk1MTc3MTQ2.jpg"],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2619463652","pubTimestamp":1773664392,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"金吾财讯","introduction":"「金吾财讯」以精准用户需求为切入点，打造一站式港美股投资细分领域品牌。依托战略合作伙伴凤凰网财经，将港美股内容传播到全球华人圈。","home_visible":1,"id":"1086022552","head_image":"https://static.tigerbbs.com/19a93586c3b023ec6ebfed568990555c"},"summary":"金吾财讯 | 天弘科技(CLS)盘前股价上扬，暂升2.86%，报271美元。消息面上，公司与AMD今日联合宣布，双方达成战略合作，将推出基于开放标准的全新 “Helios” 机柜级人工智能平台。此次合作将 AMD 在高性能计算与人工智能计算领域的领先优势，与 Celestica 在高端网络交换技术领域的专业实力深度融合。","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"zh","relate_stocks":{"IE00BMPRXR70.SGD":"Neuberger Berman 5G Connectivity A Acc SGD-H","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","BK4554":"元宇宙及AR概念","LU2089985449.USD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (USD) ACC","LU0082616367.USD":"摩根大通美国科技A（dist）","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","IE0009356076.USD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A2\" (USD) ACC","LU2931357623.SGD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (SGDHDG) ACC","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","BK4585":"ETF&股票定投概念","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","LU1242518857.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"I\" (USD) ACC","BK4588":"碎股","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU1880398471.USD":"AMUNDI FUNDS GLOBAL EQUITY \"A2\" (USD) ACC","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","LU1242518931.SGD":"Fullerton Lux Funds - Asia Absolute Alpha A Acc SGD","LU0127658192.USD":"EASTSPRING INVESTMENTS GLOBAL TECHNOLOGY \"A\" (USD) ACC","LU0979878070.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"A\" (USD) ACC","AMDY":"AMD期权收益策略ETF-YieldMax","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","LU0198837287.USD":"UBS (LUX) EQUITY SICAV - USA GROWTH \"P\" (USD) ACC","BK4529":"IDC概念","BK4566":"资本集团","DAMD":"2倍做空AMD ETF-Defiance","AMDW":"Roundhill AMD WeeklyPay ETF","LU0056508442.USD":"贝莱德世界科技基金A2","LU2054465674.USD":"UBS (LUX) KEY SELEC SICAV DIGITAL TRANSFORMATION T \"P\" (USD) ACC","LU0390134368.USD":"FRANKLIN GLOBAL GROWTH \"A\" (USD) ACC","BK4605":"半导体精选","AMDU":"Defiance Leveraged Long + Income AMD ETF","LU2250418816.HKD":"BGF WORLD TECHNOLOGY \"A\" (HKD) ACC","LU1064131342.USD":"Fullerton Lux Funds - Global Absolute Alpha A Acc USD","LU1988902786.USD":"FULLERTON LUX FUNDS GLOBAL ABSOLUTE ALPHA \"I\" (USD) ACC","AMDL":"2倍做多AMD ETF-GraniteShares","LU0274383776.USD":"MANULIFE GF US SMALL CAP EQUITY \"AA\" (USD) INC","AMDG":"2倍做多AMD ETF- Leverage Shares","LU2360107168.USD":"BGF NEXT GENERATION TECHNOLOGY \"A4\" (USD) INC","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","CLS":"天弘科技","AMDD":"1倍做空AMD ETF-Direxion","AMYY":"GraniteShares YieldBOOST AMD ETF","BK4575":"芯片概念","LU1861559042.SGD":"日兴方舟颠覆性创新基金B SGD","LU2543165471.USD":"E FUND (HK) GLOBAL QUALITY GROWTH \"A\" (USD) ACC","AMD":"美国超微公司","BK4612":"AI芯片","LU0823421333.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) ACC","LU1303367103.USD":"摩根大通多经理另类基金 A (acc)","BK4614":"Manus概念股","LU0823421416.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) INC","LU2290526834.HKD":"BGF NEXT GENERATION TECHNOLOGY \"A2\" (HKDHDG) ACC","LU2355687059.USD":"NORDEA 1 GLOBAL IMPACT  \"BP\" (USD) ACC","LU2098885051.SGD":"JPMorgan Funds - Multi-Manager Alternatives A (acc) SGD","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","IE00BMPRXQ63.HKD":"NEUBERGER BERMAN NEXT GENERATION CONNECTIVITY FUND \"A\" (HKDHDG) ACC","LU1880398554.USD":"AMUNDI FUNDS GLOBAL EQUITY \"A2\" (USD) INC","LU0823434583.USD":"BNP PARIBAS US GROWTH \"C\" (USD) ACC","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","LU0109392836.USD":"富兰克林科技股A","BK4573":"虚拟现实","LU1951198990.SGD":"Natixis Thematics AI & Robotics Fund H-R/A SGD-H","LU0823434740.USD":"BNP PARIBAS US GROWTH \"C\" (USD) INC","LU1951200564.SGD":"Natixis Thematics AI & Robotics Fund R/A SGD","BK4532":"文艺复兴科技持仓","BK4543":"AI","BK4512":"苹果概念","LU1861558580.USD":"日兴方舟颠覆性创新基金B","BK4141":"半导体产品","LU1923623000.USD":"Natixis Thematics AI & Robotics Fund R/A USD","BK4534":"瑞士信贷持仓","AMUU":"2倍做多AMD ETF-Direxion","IE00BMPRXN33.USD":"NEUBERGER BERMAN 5G CONNECTIVITY \"A\" (USD) ACC","LU1861215975.USD":"贝莱德新一代科技基金 A2","LU2045819591.USD":"Natixis WCM Global Emerging Markets Equity R/A USD","LU1861220033.SGD":"Blackrock Next Generation Technology A2 SGD-H","LU2264538146.SGD":"Fullerton Lux Funds - Global Absolute Alpha A Acc SGD","LU2125910500.SGD":"Natixis WCM Global Emerging Markets Equity H-R/A SGD","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","BK4145":"电子制造服务"},"translate_title":"Celestica Technology (CLS) rose nearly 3% premarket to launch \"Helios\" cabinet-level AI platform in partnership with AMD","themeId":"f6574e1382e251d40c42e6a229c109f8","isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AMDY":0.6,"AMDL":0.6,"DAMD":0.6,"AMDW":0.6,"AMDG":0.6,"AMYY":0.6,"AMD":1.91,"CLS":1.98,"AMDD":0.6,"AMDU":0.6,"AMUU":0.6},"content_text":"金吾财讯 | 天弘科技(CLS)盘前股价上扬，暂升2.86%，报271美元。消息面上，公司与AMD今日联合宣布，双方达成战略合作，将推出基于开放标准的全新 “Helios” 机柜级人工智能平台。此次合作将 AMD 在高性能计算与人工智能计算领域的领先优势，与 Celestica 在高端网络交换技术领域的专业实力深度融合。","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"isCrawlerRequest":true}