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·
09-30
非常好的文章，感谢！
台积电锁定12英寸碳化硅新战场，布局AI时代散热关键材料
晶圆代工龙头台积电正以一项大胆的材料转向回应这一挑战，那就是全面拥抱12英寸碳化硅单晶基板，并逐步退出氮化镓业务。此举不仅象征台积电在材料战略recalibration，更显示散热管理已经从“辅助技术”升格为“竞争优势”的关键。此前，台积电宣布，预计于2027年前逐步退出氮化镓业务，将资源转投SiC领域。此举显示公司对市场与材料策略的重新评估。因此，台积电在12英寸晶圆制造上的深厚经验，使其有别于其他竞争者。
台积电锁定12英寸碳化硅新战场，布局AI时代散热关键材料
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·
06-30
谷歌的AI和云计算领域开始发力了
谷歌云挖角甲骨文CFO 加码AI与云业务竞争
ICC讯谷歌云正通过引入关键财务人才加速其AI与云业务扩张。"Kobi的加入为谷歌云带来不同视角，这将增强其在云服务市场的竞争力。随着与亚马逊、微软和甲骨文在云与AI收入的竞争加剧，谷歌云正大力扩展数据中心规模并加强团队建设。本月早些时候，谷歌任命DeepMind CTO Koray Kavukcuoglu为新设立的首席AI架构师。目前，长期任职亚马逊的高管Swami Sivasubramanian正领导AWS的AI业务。今年3月AWS新成立的Agentic AI业务组即由其领导。
谷歌云挖角甲骨文CFO 加码AI与云业务竞争
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·
2024-11-22
$京东(JD)$
上京东，当龟公！🐢
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·
2024-10-21
$京东(JD)$
$京东集团-SW(09618)$
自己看吧
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·
2024-10-21
$京东集团-SW(09618)$
让我看看还有哪个龟龟留着京东的股票
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·
2024-10-18
$京东集团-SW(09618)$
等着出事吧………… 君子不立危墙之下，先跑为敬！
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2024-03-02
$戴尔(DELL)$
这么吊，没想到
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2024-01-31
稳中向好
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·
2023-10-19
$富途控股(FUTU)$
怎么社区讨论这么不热烈？？？
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2023-10-11
$老虎证券(TIGR)$
在等什么？挺起来！今晚胜过Futu！同
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href=\"https://laohu8.com/S/TSM\">台积电</a>正以一项大胆的材料转向回应这一挑战，那就是全面拥抱12英寸碳化硅（SiC）单晶基板，并逐步退出氮化镓（GaN）业务。此举不仅象征台积电在材料战略recalibration，更显示散热管理已经从“辅助技术”升格为“竞争优势”的关键。</p><p>碳化硅以宽能隙半导体闻名，过去主要用于高效率电力电子器件，如电动车逆变器、工业马达控制与新能源基础设施。然而，SiC的潜力不止于此，优异热导率可达约500W/mK，远高于常见陶瓷基板如氧化铝（Al2O3）或蓝宝石（Sapphire）。</p><p>AI加速器、数据中心处理器及AR智能眼镜等高密度应用逐步落地，散热空间受限问题日益严峻。尤其是在穿戴式设备中，微型芯片组件贴近眼睛，若无精确的热控将影响安全与稳定性。这使得台积电凭借长年在12英寸晶圆制程的经验，正推动以大尺寸单晶SiC取代传统陶瓷基板。这意味着不必重建制造体系，即能在既有产线导入新材料，兼顾良率与<span>成本优势</span>。</p><p>虽然，用于散热管理的SiC基板不需达到功率元件那般严苛的电性缺陷标准，但晶体完整性依旧至关重要。许多外在因素不仅会干扰声子传导，削弱热导率，还可能造成局部过热，进而影响机械强度与表面平整度。对12英寸大尺寸晶圆而言，翘曲与变形更是关键课题，因其直接影响芯片贴合与先进封装的良率。因此，业界焦点已从“消除电性缺陷”转向“确保体密度均匀、低孔隙率与高表面平整度”，这些条件被视为高良率量产SiC散热基板的前提。</p><p>报导表示，SiC结合了高热导率、强机械性与抗热冲击性，在2.5D与3D封装架构中展现出独特优势。例如在2.5D整合方面，芯片并排架设于硅或有机中介层上，信号连接短且高效，散热挑战主要在水平方向上。另外，在3D整合方面，芯片透过硅通孔（TSV）或混合键合垂直堆叠，连线密度极高，但散热压力也随之倍增。因此，SiC除了能作为被动散热材料，亦可搭配钻石、液态金属等先进散热方案，构成“混合式冷却”解决方案。</p><p>此前，台积电宣布，预计于2027年前逐步退出氮化镓（GaN）业务，将资源转投SiC领域。此举显示公司对市场与材料策略的重新评估。因为相比GaN在高频应用优势，SiC在热管理的全面性与可扩展性更符合台积电的长远布局。12英寸大尺寸化，不仅可降低单位成本，还能提升制程均匀性。尽管SiC在切片、抛光与平坦化上仍面临挑战，但台积电的既有设备与封装工艺能力，使其有望克服障碍，加速量产落地。</p><p>事实上，过去SiC几乎与电动车功率元件划上等号。然而，台积电正推动SiC跨入新应用，例如导电型N型SiC作为散热基板，在高效能处理器、AI加速器中承担热扩散角色；或者半绝缘型SiC为中介层（Interposer），以在芯片分割与chiplet设计，提供电性隔离与热传导兼顾的解决方案。这些新路径，意味着SiC不再只是“电力电子的代名词”，而是将成为AI与数据中心芯片“热管理骨干”的基石材料。</p><p>高阶材料领域，钻石与石墨烯虽拥有极高热导率（钻石可达1,000~2,200W/mK，单层石墨烯更高达3,000~5,000W/mK），但其高昂成本与制程规模化困难，使其难以成为主流。液态金属、导电凝胶与微流体冷却等替代方案虽有潜力，但在整合性与量产成本上亦存挑战。相较之下，SiC以“性能、机械强度与可量产性兼具”的特点，展现出最具实际性的折衷方案。</p><p>因此，台积电在12英寸晶圆制造上的深厚经验，使其有别于其他竞争者。不仅能以既有基础加速SiC平台建构，还能凭借高度制程控制能力，快速将材料优势转化为系统级散热方案。与此同时，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>推动背面供电（Backside Power Delivery）与热─功率协同设计，显示全球龙头厂商皆已将散热视为核心竞争力。</p><p><strong>参考信息</strong>：本文部分素材和图片来自网络公开信息，本平台发布仅为了传达一种不同观点，不代表对该观点赞同或支持。如果有任何问题，请联系<strong>19045661526（同微信）</strong>。</p><img src=\"https://mmbiz.qpic.cn/sz_mmbiz_png/OIc0Gsk6so1c8YrGKAC41eVWzR4icRs8bAQB3shNYuJXsGCNQUjh1FCba45FzzHoGN7P0CWDZEwmIGiaXDw6iaUJA/640?wx_fmt=png&from=appmsg#imgIndex=1\"/><img src=\"https://mmbiz.qpic.cn/sz_mmbiz_jpg/OIc0Gsk6so0jNdNwOd1VU0HIh7jPczJ3ntQ8Picyf0peibNh57EC4ksvH97d6yxft0LarMVtKoC4iccwucSKYOiaKg/640?wx_fmt=jpeg&from=appmsg#imgIndex=3\"/></article></body></html>","source":"tencent","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" 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#eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n台积电锁定12英寸碳化硅新战场，布局AI时代散热关键材料\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-09-30 00:01 北京时间 <a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025093000191597b14afe&s=b><strong>DT新材料</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>据科技新报消息，全球半导体产业迈入人工智能（AI）与高效能运算（HPC）驱动的新时代，散热管理正逐渐成为影响芯片设计与制程能否突破的核心瓶颈。当3D堆叠、2.5D整合等先进封装架构持续推升芯片密度与功耗，传统陶瓷基板已难以满足热通量需求。晶圆代工龙头台积电正以一项大胆的材料转向回应这一挑战，那就是全面拥抱12英寸碳化硅（SiC）单晶基板，并逐步退出氮化镓（GaN）业务。此举不仅象征台积电在材料战略...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025093000191597b14afe&s=b\">Web Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"LU0316494557.USD":"FRANKLIN GLOBAL FUNDAMENTAL STRATEGIES \"A\" ACC","BK4588":"碎股","LU2491050071.SGD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (SGDHDG) ACC","IE00BFXG0V08.USD":"BNY MELLON GLOBAL LEADERS \"B\" (USD) ACC","LU1868837565.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"1\" (USD) ACC","LU2506951792.HKD":"BNP PARIBAS ENERGY TRANSITION \"CRH\" (HKDHDG) ACC","IE0004091025.USD":"BNY MELLON 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ACC"},"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025093000191597b14afe&s=b","is_english":false,"share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","article_id":"2571810355","content_text":"据科技新报消息，全球半导体产业迈入人工智能（AI）与高效能运算（HPC）驱动的新时代，散热管理正逐渐成为影响芯片设计与制程能否突破的核心瓶颈。当3D堆叠、2.5D整合等先进封装架构持续推升芯片密度与功耗，传统陶瓷基板已难以满足热通量需求。晶圆代工龙头台积电正以一项大胆的材料转向回应这一挑战，那就是全面拥抱12英寸碳化硅（SiC）单晶基板，并逐步退出氮化镓（GaN）业务。此举不仅象征台积电在材料战略recalibration，更显示散热管理已经从“辅助技术”升格为“竞争优势”的关键。碳化硅以宽能隙半导体闻名，过去主要用于高效率电力电子器件，如电动车逆变器、工业马达控制与新能源基础设施。然而，SiC的潜力不止于此，优异热导率可达约500W/mK，远高于常见陶瓷基板如氧化铝（Al2O3）或蓝宝石（Sapphire）。AI加速器、数据中心处理器及AR智能眼镜等高密度应用逐步落地，散热空间受限问题日益严峻。尤其是在穿戴式设备中，微型芯片组件贴近眼睛，若无精确的热控将影响安全与稳定性。这使得台积电凭借长年在12英寸晶圆制程的经验，正推动以大尺寸单晶SiC取代传统陶瓷基板。这意味着不必重建制造体系，即能在既有产线导入新材料，兼顾良率与成本优势。虽然，用于散热管理的SiC基板不需达到功率元件那般严苛的电性缺陷标准，但晶体完整性依旧至关重要。许多外在因素不仅会干扰声子传导，削弱热导率，还可能造成局部过热，进而影响机械强度与表面平整度。对12英寸大尺寸晶圆而言，翘曲与变形更是关键课题，因其直接影响芯片贴合与先进封装的良率。因此，业界焦点已从“消除电性缺陷”转向“确保体密度均匀、低孔隙率与高表面平整度”，这些条件被视为高良率量产SiC散热基板的前提。报导表示，SiC结合了高热导率、强机械性与抗热冲击性，在2.5D与3D封装架构中展现出独特优势。例如在2.5D整合方面，芯片并排架设于硅或有机中介层上，信号连接短且高效，散热挑战主要在水平方向上。另外，在3D整合方面，芯片透过硅通孔（TSV）或混合键合垂直堆叠，连线密度极高，但散热压力也随之倍增。因此，SiC除了能作为被动散热材料，亦可搭配钻石、液态金属等先进散热方案，构成“混合式冷却”解决方案。此前，台积电宣布，预计于2027年前逐步退出氮化镓（GaN）业务，将资源转投SiC领域。此举显示公司对市场与材料策略的重新评估。因为相比GaN在高频应用优势，SiC在热管理的全面性与可扩展性更符合台积电的长远布局。12英寸大尺寸化，不仅可降低单位成本，还能提升制程均匀性。尽管SiC在切片、抛光与平坦化上仍面临挑战，但台积电的既有设备与封装工艺能力，使其有望克服障碍，加速量产落地。事实上，过去SiC几乎与电动车功率元件划上等号。然而，台积电正推动SiC跨入新应用，例如导电型N型SiC作为散热基板，在高效能处理器、AI加速器中承担热扩散角色；或者半绝缘型SiC为中介层（Interposer），以在芯片分割与chiplet设计，提供电性隔离与热传导兼顾的解决方案。这些新路径，意味着SiC不再只是“电力电子的代名词”，而是将成为AI与数据中心芯片“热管理骨干”的基石材料。高阶材料领域，钻石与石墨烯虽拥有极高热导率（钻石可达1,000~2,200W/mK，单层石墨烯更高达3,000~5,000W/mK），但其高昂成本与制程规模化困难，使其难以成为主流。液态金属、导电凝胶与微流体冷却等替代方案虽有潜力，但在整合性与量产成本上亦存挑战。相较之下，SiC以“性能、机械强度与可量产性兼具”的特点，展现出最具实际性的折衷方案。因此，台积电在12英寸晶圆制造上的深厚经验，使其有别于其他竞争者。不仅能以既有基础加速SiC平台建构，还能凭借高度制程控制能力，快速将材料优势转化为系统级散热方案。与此同时，英特尔推动背面供电（Backside Power Delivery）与热─功率协同设计，显示全球龙头厂商皆已将散热视为核心竞争力。参考信息：本文部分素材和图片来自网络公开信息，本平台发布仅为了传达一种不同观点，不代表对该观点赞同或支持。如果有任何问题，请联系19045661526（同微信）。","news_type":1,"symbols_score_info":{"03145":0.6,"TSM":1.5}},"isVote":1,"tweetType":1,"viewCount":187,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"CN","totalScore":0},{"id":451642490491416,"gmtCreate":1751289717953,"gmtModify":1751289719693,"author":{"id":"3493795337639736","authorId":"3493795337639736","name":"Alphabets","avatar":"https://static.tigerbbs.com/56b77e37f69d75881bb0e3579ec38396","crmLevel":8,"crmLevelSwitch":0,"followedFlag":false,"idStr":"3493795337639736","authorIdStr":"3493795337639736"},"themes":[],"htmlText":"谷歌的AI和云计算领域开始发力了","listText":"谷歌的AI和云计算领域开始发力了","text":"谷歌的AI和云计算领域开始发力了","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/451642490491416","repostId":"2547319200","repostType":2,"repost":{"id":"2547319200","kind":"news","pubTimestamp":1751246291,"share":"https://www.laohu8.com/m/news/2547319200?lang=&edition=full","pubTime":"2025-06-30 09:18","market":"us","language":"zh","title":"谷歌云挖角甲骨文CFO 加码AI与云业务竞争","url":"https://stock-news.laohu8.com/highlight/detail?id=2547319200","media":"讯石光通讯网","summary":"ICC讯谷歌云正通过引入关键财务人才加速其AI与云业务扩张。\"Kobi的加入为谷歌云带来不同视角，这将增强其在云服务市场的竞争力。随着与亚马逊、微软和甲骨文在云与AI收入的竞争加剧，谷歌云正大力扩展数据中心规模并加强团队建设。本月早些时候，谷歌任命DeepMind CTO Koray Kavukcuoglu为新设立的首席AI架构师。目前，长期任职亚马逊的高管Swami Sivasubramanian正领导AWS的AI业务。今年3月AWS新成立的Agentic AI业务组即由其领导。","content":"<html><body><article><p> <strong>ICC</strong><strong>讯</strong><a href=\"https://laohu8.com/S/GOOG\">谷歌</a>云正通过引入关键财务人才加速其AI与云业务扩张。根据LinkedIn资料显示，该公司已聘请<a href=\"https://laohu8.com/S/ORCL\">甲骨文</a>云基础设施首席财务官Kobi Bar-Nathan担任谷歌云新任CFO。这是谷歌云近几个月来一系列高管任命中的最新动作。</p><p> Bar-Nathan在甲骨文任职近六年，先后担任甲骨文云基础设施财务副总裁和CFO。此前他还在<a href=\"https://laohu8.com/S/MSFT\">微软</a>工作超过十年（2008-2018年），最终担任微软云基础设施财务总监。其前任Kathy Bonanno似乎已于五月离职。</p><p> \"Kobi的加入为谷歌云带来不同视角，这将增强其在云服务市场的竞争力。\"Recon Analytics分析师Daryl Schoolar表示，\"虽然部分甲骨文专有知识受保密协议限制，但他仍可运用在甲骨文积累的广泛市场洞察。\"</p><p> 谷歌云业务在多年亏损后，于2023年第一季度首次实现1.91亿美元运营利润，到2025年第一季度该数字已飙升至21亿美元。随着与<a href=\"https://laohu8.com/S/AMZN\">亚马逊</a>、微软和甲骨文在云与AI收入的竞争加剧，谷歌云正大力扩展数据中心规模并加强团队建设。</p><p> 本月早些时候，谷歌任命DeepMind CTO Koray Kavukcuoglu为新设立的首席AI架构师。今年1月，该公司还聘请前<a href=\"https://laohu8.com/S/ILMN\">Illumina</a> CEO Francis DeSouza担任谷歌云COO，并从微软挖来Rehan Sheikh出任全球硅芯片技术与制造副总裁。</p><p> Schoolar补充道：\"谷歌云近期的招聘热潮向市场传递积极信号，表明公司坚定投入云业务。在竞争激烈的云服务市场，这对建立合作伙伴和客户的长期信心至关重要，可转化为相对于AWS、微软等对手的竞争优势。\"</p><p> 与此同时，亚马逊AWS也出现高管变动。据路透社最新报道，AWS生成式AI副总裁Vasi Philomin已离职。虽然其去向尚未明确，但LinkedIn资料显示Philomin深度参与了Amazon Bedrock、Amazon Q和Amazon CodeWhisperer等AI产品的开发。这是AWS不到一年内第二位离职的AI高管——2024年10月，任职15年的AWS AI副总裁Matt Wood离职加入普华永道担任CTIO。</p><p> 目前，长期任职亚马逊的高管Swami Sivasubramanian正领导AWS的AI业务。他最近担任AWS AI和数据副总裁，现为Agentic AI负责人。今年3月AWS新成立的Agentic AI业务组即由其领导。</p></article></body></html>","source":"tencent","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" 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href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202506300919179793f056&s=b><strong>讯石光通讯网</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>ICC讯谷歌云正通过引入关键财务人才加速其AI与云业务扩张。根据LinkedIn资料显示，该公司已聘请甲骨文云基础设施首席财务官Kobi Bar-Nathan担任谷歌云新任CFO。这是谷歌云近几个月来一系列高管任命中的最新动作。 Bar-Nathan在甲骨文任职近六年，先后担任甲骨文云基础设施财务副总裁和CFO。此前他还在微软工作超过十年（2008-2018年），最终担任微软云基础设施财务总监。...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202506300919179793f056&s=b\">Web Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"LU2462157665.USD":"ALLIANZ GLOBAL INCOME \"A\" (USD) INC","GB00B4QBRK32.GBP":"FUNDSMITH EQUITY \"R\" (GBP) INC","LU2381873111.SGD":"BGF SYSTEMATIC GLOBAL EQUITY HIGH INCOME \"A6\" (SGDHDG) INC","SG9999015978.USD":"利安颠覆性创新基金A","IE00BQXX3D17.EUR":"GUINNESS GLOBAL INNOVATORS \"C\" (EUR) ACC","LU2471134523.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) ACC","SG9999001424.SGD":"United 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SGD"},"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202506300919179793f056&s=b","is_english":false,"share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","article_id":"2547319200","content_text":"ICC讯谷歌云正通过引入关键财务人才加速其AI与云业务扩张。根据LinkedIn资料显示，该公司已聘请甲骨文云基础设施首席财务官Kobi Bar-Nathan担任谷歌云新任CFO。这是谷歌云近几个月来一系列高管任命中的最新动作。 Bar-Nathan在甲骨文任职近六年，先后担任甲骨文云基础设施财务副总裁和CFO。此前他还在微软工作超过十年（2008-2018年），最终担任微软云基础设施财务总监。其前任Kathy Bonanno似乎已于五月离职。 \"Kobi的加入为谷歌云带来不同视角，这将增强其在云服务市场的竞争力。\"Recon Analytics分析师Daryl Schoolar表示，\"虽然部分甲骨文专有知识受保密协议限制，但他仍可运用在甲骨文积累的广泛市场洞察。\" 谷歌云业务在多年亏损后，于2023年第一季度首次实现1.91亿美元运营利润，到2025年第一季度该数字已飙升至21亿美元。随着与亚马逊、微软和甲骨文在云与AI收入的竞争加剧，谷歌云正大力扩展数据中心规模并加强团队建设。 本月早些时候，谷歌任命DeepMind CTO Koray Kavukcuoglu为新设立的首席AI架构师。今年1月，该公司还聘请前Illumina CEO Francis DeSouza担任谷歌云COO，并从微软挖来Rehan Sheikh出任全球硅芯片技术与制造副总裁。 Schoolar补充道：\"谷歌云近期的招聘热潮向市场传递积极信号，表明公司坚定投入云业务。在竞争激烈的云服务市场，这对建立合作伙伴和客户的长期信心至关重要，可转化为相对于AWS、微软等对手的竞争优势。\" 与此同时，亚马逊AWS也出现高管变动。据路透社最新报道，AWS生成式AI副总裁Vasi Philomin已离职。虽然其去向尚未明确，但LinkedIn资料显示Philomin深度参与了Amazon Bedrock、Amazon Q和Amazon CodeWhisperer等AI产品的开发。这是AWS不到一年内第二位离职的AI高管——2024年10月，任职15年的AWS AI副总裁Matt Wood离职加入普华永道担任CTIO。 目前，长期任职亚马逊的高管Swami Sivasubramanian正领导AWS的AI业务。他最近担任AWS AI和数据副总裁，现为Agentic AI负责人。今年3月AWS新成立的Agentic AI业务组即由其领导。","news_type":1,"symbols_score_info":{"GOOG":1,"GOOGL":1,"MSFT":0.9,"ORCL":1,"USJW.SI":0.6}},"isVote":1,"tweetType":1,"viewCount":1436,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"CN","totalScore":0},{"id":373745231172088,"gmtCreate":1732286896044,"gmtModify":1732287196315,"author":{"id":"3493795337639736","authorId":"3493795337639736","name":"Alphabets","avatar":"https://static.tigerbbs.com/56b77e37f69d75881bb0e3579ec38396","crmLevel":8,"crmLevelSwitch":0,"followedFlag":false,"idStr":"3493795337639736","authorIdStr":"3493795337639736"},"themes":[],"htmlText":"<a href=\"https://laohu8.com/S/JD\">$京东(JD)$ </a> 上京东，当龟公！🐢","listText":"<a 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