个人中心 - 老虎社区

大灰狼赫斯

IP属地：上海

帖子 · 1帖子 · 1
关注 · 0关注 · 0
粉丝 · 0粉丝 · 0

- 大灰狼赫斯大灰狼赫斯
  ·04-15
  这篇文章不错，转发给大家看看
  小米成立芯片平台部，秦牧云担任负责人！王化：手机产品部芯片平台部一直存在
  新浪科技讯 4月15日下午消息，新浪科技独家获悉，小米日前内部宣布，在手机部产品部组织架构下成立芯片平台部，任命秦牧云担任芯片平台部负责人，向产品部总经理李俊汇报。资料显示，秦牧云此前曾在高通任职，担任高通产品市场高级总监，后加入小米。此后，小米并未放弃自研芯片的梦想。2024年底，北京卫视报道了小米成功流片国内首款3nm手机系统级芯片的消息。但这款新机的具体规格，仍待小米官方确认。
  小米成立芯片平台部，秦牧云担任负责人！王化：手机产品部芯片平台部一直存在
  424 评论
  1
  分享
  举报

热议股票

{"i18n":{"language":"zh_CN"},"isCurrentUser":false,"userPageInfo":{"id":"4193801600623390","uuid":"4193801600623390","gmtCreate":1730698466230,"gmtModify":1740017320955,"name":"大灰狼赫斯","pinyin":"dhlhsdahuilanghesi","introduction":"","introductionEn":null,"signature":"","avatar":"https://community-static.tradeup.com/news/default-avatar.jpg","hat":null,"hatId":null,"hatName":null,"vip":1,"status":2,"fanSize":0,"headSize":13,"tweetSize":1,"questionSize":0,"limitLevel":999,"accountStatus":1,"level":{"id":0,"name":"","nameTw":"","represent":"","factor":"","iconColor":"","bgColor":""},"themeCounts":5,"badgeCounts":0,"badges":[],"moderator":false,"superModerator":false,"manageSymbols":null,"badgeLevel":null,"boolIsFan":false,"boolIsHead":false,"favoriteSize":3,"symbols":null,"coverImage":null,"realNameVerified":"success","userBadges":[{"badgeId":"35ec162348d5460f88c959321e554969-3","templateUuid":"35ec162348d5460f88c959321e554969","name":"传说交易员","description":"证券或期货账户累计交易次数达到300次","bigImgUrl":"https://static.tigerbbs.com/656db16598a0b8f21429e10d6c1cb033","smallImgUrl":"https://static.tigerbbs.com/03f10910d4dd9234f9b5702a3342193a","grayImgUrl":"https://static.tigerbbs.com/0c767e35268feb729d50d3fa9a386c5a","redirectLinkEnabled":0,"redirectLink":null,"hasAllocated":1,"isWearing":0,"stamp":null,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2025.05.24","exceedPercentage":"93.45%","individualDisplayEnabled":0,"backgroundColor":null,"fontColor":null,"individualDisplaySort":0,"categoryType":1100},{"badgeId":"228c86a078844d74991fff2b7ab2428d-2","templateUuid":"228c86a078844d74991fff2b7ab2428d","name":"投资总监虎","description":"证券账户累计交易金额达到30万美元","bigImgUrl":"https://static.tigerbbs.com/9d20b23f1b6335407f882bc5c2ad12c0","smallImgUrl":"https://static.tigerbbs.com/ada3b4533518ace8404a3f6dd192bd29","grayImgUrl":"https://static.tigerbbs.com/177f283ba21d1c077054dac07f88f3bd","redirectLinkEnabled":0,"redirectLink":null,"hasAllocated":1,"isWearing":0,"stamp":null,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2025.03.27","exceedPercentage":"80.93%","individualDisplayEnabled":0,"backgroundColor":null,"fontColor":null,"individualDisplaySort":0,"categoryType":1101},{"badgeId":"976c19eed35f4cd78f17501c2e99ef37-1","templateUuid":"976c19eed35f4cd78f17501c2e99ef37","name":"博闻投资者","description":"累计交易超过10只正股","bigImgUrl":"https://static.tigerbbs.com/e74cc24115c4fbae6154ec1b1041bf47","smallImgUrl":"https://static.tigerbbs.com/d48265cbfd97c57f9048db29f22227b0","grayImgUrl":"https://static.tigerbbs.com/76c6d6898b073c77e1c537ebe9ac1c57","redirectLinkEnabled":0,"redirectLink":null,"hasAllocated":1,"isWearing":0,"stamp":null,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2025.03.04","exceedPercentage":null,"individualDisplayEnabled":0,"backgroundColor":null,"fontColor":null,"individualDisplaySort":0,"categoryType":1102},{"badgeId":"518b5610c3e8410da5cfad115e4b0f5a-1","templateUuid":"518b5610c3e8410da5cfad115e4b0f5a","name":"实盘交易者","description":"完成一笔实盘交易","bigImgUrl":"https://static.tigerbbs.com/2e08a1cc2087a1de93402c2c290fa65b","smallImgUrl":"https://static.tigerbbs.com/4504a6397ce1137932d56e5f4ce27166","grayImgUrl":"https://static.tigerbbs.com/4b22c79415b4cd6e3d8ebc4a0fa32604","redirectLinkEnabled":0,"redirectLink":null,"hasAllocated":1,"isWearing":0,"stamp":null,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2025.02.21","exceedPercentage":null,"individualDisplayEnabled":0,"backgroundColor":null,"fontColor":null,"individualDisplaySort":0,"categoryType":1100}],"userBadgeCount":4,"currentWearingBadge":null,"individualDisplayBadges":null,"crmLevel":7,"crmLevelSwitch":0,"location":"上海","starInvestorFollowerNum":0,"starInvestorFlag":false,"starInvestorOrderShareNum":0,"subscribeStarInvestorNum":5,"ror":null,"winRationPercentage":null,"showRor":false,"investmentPhilosophy":null,"starInvestorSubscribeFlag":false},"page":1,"watchlist":null,"tweetList":[{"id":424750001815920,"gmtCreate":1744708177266,"gmtModify":1744709965413,"author":{"id":"4193801600623390","authorId":"4193801600623390","name":"大灰狼赫斯","avatar":"https://community-static.tradeup.com/news/default-avatar.jpg","crmLevel":7,"crmLevelSwitch":0,"followedFlag":false,"idStr":"4193801600623390","authorIdStr":"4193801600623390"},"themes":[],"htmlText":"这篇文章不错，转发给大家看看","listText":"这篇文章不错，转发给大家看看","text":"这篇文章不错，转发给大家看看","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/424750001815920","repostId":"1152471266","repostType":4,"repost":{"id":"1152471266","kind":"news","pubTimestamp":1744707815,"share":"https://www.laohu8.com/m/news/1152471266?lang=&edition=full","pubTime":"2025-04-15 17:03","market":"us","language":"zh","title":"小米成立芯片平台部，秦牧云担任负责人！王化：手机产品部芯片平台部一直存在","url":"https://stock-news.laohu8.com/highlight/detail?id=1152471266","media":"新浪科技","summary":"新浪科技讯 4月15日下午消息，新浪科技独家获悉，小米日前内部宣布，在手机部产品部组织架构下成立芯片平台部，任命秦牧云担任芯片平台部负责人，向产品部总经理李俊汇报。资料显示，秦牧云此前曾在高通任职，担任高通产品市场高级总监，后加入小米。此后，小米并未放弃自研芯片的梦想。2024年底，北京卫视报道了小米成功流片国内首款3nm手机系统级芯片的消息。但这款新机的具体规格，仍待小米官方确认。","content":"<html><head></head><body><p style=\"text-align: start;\">新浪科技讯 4月15日下午消息，新浪科技独家获悉，小米日前内部宣布，在手机部产品部组织架构下成立芯片平台部，任命秦牧云担任芯片平台部负责人，向产品部总经理李俊汇报。</p><p style=\"text-align: start;\">资料显示，秦牧云此前曾在高通任职，担任高通产品市场高级总监，后加入小米。</p><p style=\"text-align: start;\">此时，也正值小米最新的自研SoC芯片对外亮相前的关键时刻。2017年，小米发布了自研SoC芯片澎湃S1，小米正式成为全球继三星、苹果、华为之后第四家同时拥有终端及芯片研发制造能力的手机厂商。澎湃S1为8核64位处理器，采用28nm工艺制程，由小米5C首发搭载。不过这款手机并未成为爆款，也让小米澎湃S1蒙尘。</p><p style=\"text-align: start;\">此后，小米并未放弃自研芯片的梦想。近年来，小米在影像、快充、电源管理、通信、显示等多个领域推出了自研芯片，比如澎湃C系列影像芯片、澎湃P系列快充芯片、澎湃G系列电源管理芯片、澎湃T系列信号增强芯片、澎湃D系列独显芯片等，从小芯片入手积累能力。</p><p style=\"text-align: start;\">2024年底，北京卫视报道了小米成功流片国内首款3nm手机系统级芯片的消息。近期有消息称，小米15S Pro将首发搭载小米自研SoC芯片登场。日前，小米联合创始人、副董事长林斌也在微博上回复网友时首次确认了小米15S Pro新机的存在。但这款新机的具体规格，仍待小米官方确认。</p><p><strong>小米王化：手机产品部芯片平台部一直存在</strong></p><p>小米集团公关部总经理王化4月15日表示，手机产品部的芯片平台部一直存在，其部门工作主要是负责手机产品的芯片平台选型评估和深度定制。王化称，“负责人秦牧云兄弟加入公司都有好几年了，至少我俩2021年就有小米办公的工作聊天记录了”。</p></body></html>","source":"sina_tech","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>小米成立芯片平台部，秦牧云担任负责人！王化：手机产品部芯片平台部一直存在</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n小米成立芯片平台部，秦牧云担任负责人！王化：手机产品部芯片平台部一直存在\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-04-15 17:03 北京时间&nbsp;&nbsp;&nbsp;<a href=https://finance.sina.com.cn/tech/2025-04-15/doc-inetftfu7854535.shtml><strong>新浪科技</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>新浪科技讯 4月15日下午消息，新浪科技独家获悉，小米日前内部宣布，在手机部产品部组织架构下成立芯片平台部，任命秦牧云担任芯片平台部负责人，向产品部总经理李俊汇报。资料显示，秦牧云此前曾在高通任职，担任高通产品市场高级总监，后加入小米。此时，也正值小米最新的自研SoC芯片对外亮相前的关键时刻。2017年，小米发布了自研SoC芯片澎湃S1，小米正式成为全球继三星、苹果、华为之后第四家同时拥有终端及...</p>\n\n<a href=\"https://finance.sina.com.cn/tech/2025-04-15/doc-inetftfu7854535.shtml\">Web Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"https://static.tigerbbs.com/99b330c7a5fe2b62c4d008bd67f85ddd","relate_stocks":{},"source_url":"https://finance.sina.com.cn/tech/2025-04-15/doc-inetftfu7854535.shtml","is_english":false,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1152471266","content_text":"新浪科技讯 4月15日下午消息，新浪科技独家获悉，小米日前内部宣布，在手机部产品部组织架构下成立芯片平台部，任命秦牧云担任芯片平台部负责人，向产品部总经理李俊汇报。资料显示，秦牧云此前曾在高通任职，担任高通产品市场高级总监，后加入小米。此时，也正值小米最新的自研SoC芯片对外亮相前的关键时刻。2017年，小米发布了自研SoC芯片澎湃S1，小米正式成为全球继三星、苹果、华为之后第四家同时拥有终端及芯片研发制造能力的手机厂商。澎湃S1为8核64位处理器，采用28nm工艺制程，由小米5C首发搭载。不过这款手机并未成为爆款，也让小米澎湃S1蒙尘。此后，小米并未放弃自研芯片的梦想。近年来，小米在影像、快充、电源管理、通信、显示等多个领域推出了自研芯片，比如澎湃C系列影像芯片、澎湃P系列快充芯片、澎湃G系列电源管理芯片、澎湃T系列信号增强芯片、澎湃D系列独显芯片等，从小芯片入手积累能力。2024年底，北京卫视报道了小米成功流片国内首款3nm手机系统级芯片的消息。近期有消息称，小米15S Pro将首发搭载小米自研SoC芯片登场。日前，小米联合创始人、副董事长林斌也在微博上回复网友时首次确认了小米15S Pro新机的存在。但这款新机的具体规格，仍待小米官方确认。小米王化：手机产品部芯片平台部一直存在小米集团公关部总经理王化4月15日表示，手机产品部的芯片平台部一直存在，其部门工作主要是负责手机产品的芯片平台选型评估和深度定制。王化称，“负责人秦牧云兄弟加入公司都有好几年了，至少我俩2021年就有小米办公的工作聊天记录了”。","news_type":1},"isVote":1,"tweetType":1,"viewCount":424,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"CN","totalScore":0}],"defaultTab":"posts","isTTM":false}