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小米最强芯片！曝玄戒O2坚守台积电3nm：明年登场

快科技9月3日消息，博主数码闲聊站表示，小米下一代玄戒芯片还是基于3nm工艺制程制造，今年不会迭代。由此看来，玄戒O2将在明年登场，可能由小米16S Pro首发搭载，是小米最强悍的自研芯片。从全球范围内来看，小米把核心技术牢牢把握在自己手中，能最大程度避免受制于人。资料显示，今年上半年小米带来了玄戒O1，基于台积电3nm制程制造，由小米15S Pro首发。

小米最强芯片！曝玄戒O2坚守台积电3nm：明年登场

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href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250903075720950f99f0&s=b\">Web Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"81810":"小米集团-WR","LU2097828714.EUR":"AZ EQUITY CHINA \"BAZ\" (EUR) ACC","LU2399975544.HKD":"ALLIANZ ALL CHINA EQUITY \"AT\" (HKD) ACC","LU0823038988.USD":"AMUNDI FUNDS ASIA EQUITY FOCUS  \"A2\" (USD) ACC","LU0561508036.HKD":"ALLIANZ CHINA EQUITY \"A\" (HKD) INC","LU0348816934.USD":"ALLIANZ TOTAL RETURN ASIAN EQUITY \"AT\" (USD)","BK1506":"5G概念","LU0441854154.USD":"JPM ASIA PACIFIC EQUITY \"A\" (USD) ACC","01810":"小米集团-W","HXXD.SI":"Xiaomi HK SDR 2to1","LU2097828474.EUR":"AZ EQUITY CHINA \"A\" (EUR) ACC A","LU0164872284.USD":"HSBC GIF GLOBAL EMERGING MARKETS EQUITY \"A\" (USD) ACC","LU0797268264.HKD":"ALLIANZ TOTAL RETURN ASIAN EQUITY \"AT\" (HKD) ACC","IE00B3M56506.USD":"NEUBERGER BERMAN EMERGING MARKETS EQUITY \"A\" (USD) 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