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TrendForce：AI需求催生封装变革，ASICs转向EMIB技术

TrendForce最新研究显示，AI HPC对异质整合的需求依赖先进封装技术，其中TSMC的CoWoS解决方案是关键技术。TrendForce指出，CoWoS方案通过中介层连接不同功能芯片，目前已发展出CoWoS-S、CoWoS-R与CoWoS-L等技术。TrendForce预测，随着Google决定在2027年TPUv9导入EMIB试用，Meta亦积极评估用于其MTIA产品，EMIB技术有望为Intel Foundry Services业务带来重大进展。此外，TrendForce还发布2026年十大科技市场趋势预测，涵盖AI服务器、存储器、晶圆代工等领域。

TrendForce：AI需求催生封装变革，ASICs转向EMIB技术

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...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251130115353a4c310e6&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"BK4581":"高盛持仓","LU2420271590.USD":"ALLIANZ SELECT INCOME AND GROWTH \"AT\" (USD) ACC","LU1868836914.USD":"CT (LUX) I AMERICAN \"3\" (USD) ACC","LU0238689110.USD":"贝莱德环球动力股票基金","LU0310799852.SGD":"FTIF - Templeton Global Equity Income A MDIS SGD","LU1116320737.USD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A6\" (USD) INC","LU2065171402.SGD":"M&G (LUX) GLOBAL MAXIMA \"A\" (SGD) INC","TSM":"台积电","LU0265550946.USD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A5\" (USD) INC","BK4585":"ETF&股票定投概念","LU0488056044.USD":"Allianz Asian Multi Income Plus Cl AM DIS USD","BK4141":"半导体产品","LU0011850046.USD":"贝莱德全球长线股票 A2 USD","LU0882574139.USD":"富达环球消费行业基金A ACC","LU0823414478.USD":"法巴经典能源转换基金","LU0823421333.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) 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