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Doudou123
01-04

达哥加油

CES 2026前瞻：英伟达或重塑物理AI，中美韩机器人齐“秀肌肉”

CES 2026凸显芯片巨头战略分野：英伟达重心转向工业AI与机器人，而AMD与英特尔则坚守并升级传统PC市场。展会焦点已从消费电子转向人形机器人、AI定义汽车及卷轴屏等颠覆性硬件的产业化竞速，中、美、韩厂商在各赛道展开激烈角逐。

CES 2026前瞻：英伟达或重塑物理AI，中美韩机器人齐“秀肌肉”

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left;\"><strong>AMD： 采取稳健升级策略。</strong>桌面端预计推出Ryzen 9000系列，其中旗舰Ryzen 9 9950X3D2将搭载双芯片3D V-Cache，L3缓存达192MB，针对工作站用户。移动端将发布Ryzen AI 400系列（代号Gorgon Point）以巩固PC市场。</p></li><li><p style=\"text-align: left;\"><strong>英特尔（Intel）： 面临关键一战。</strong>将发布Intel Core Ultra Series 3（Panther Lake），预计包含约14款SKU。旗舰型号Core Ultra X9 388H配备16核，最高频率5.1GHz。若能获得OEM广泛支持，将有助于缓解市场对其先进制程执行力的疑虑。</p></li></ul></blockquote><h2 id=\"id_425381033\" style=\"text-align: left;\">具身智能战场：从中美韩“三国杀”看执行力进阶</h2><p style=\"text-align: left;\">2026年被视为人形机器人从Demo走向工位的关键年份，核心看点在于“降本增效”与“实战验证”。</p><blockquote><ul style=\"\"><li><p style=\"text-align: left;\"><strong>中国阵营（成本与量产）：</strong> 宇树和智元继续主导成本控制。宇树或展示G1量产版在工厂流水线的操作；智元将展示X2、A2等全系列产品及灵巧手等核心部件。</p></li><li><p style=\"text-align: left;\"><strong>美国阵营（技术标杆）：</strong> 波士顿动力的全电动Atlas将进行首次公开演示，直接对标特斯拉Optimus，展示商业化潜力。</p></li><li><p style=\"text-align: left;\"><strong>韩国阵营（产业链抱团）：</strong> 韩国将展示“K-Humanoid”联盟，由三星投资的Rainbow Robotics领衔。展品包括轮式底盘工业级人形机器人HMND 01 Alpha（身高220厘米，载荷15公斤），显示出韩国在零部件到整机全产业链的整合野心。</p></li></ul></blockquote><h2 id=\"id_2228659297\" style=\"text-align: left;\">端侧 AI 与 XR：安卓阵营的反击与中国厂商的“轻量化”突围</h2><p style=\"text-align: left;\">XR市场正在经历Apple Vision Pro发布后的“消化期”，CES 2026将是安卓阵营反击的起点。</p><blockquote><ul style=\"\"><li><p style=\"text-align: left;\"><strong>三星/谷歌联盟：</strong>三星将首秀获CES创新奖的Galaxy XR眼镜，搭载高通Snapdragon XR2+ Gen 3芯片，运行Android XR系统并深度集成Gemini AI，试图构建与苹果抗衡的生态。</p></li><li><p style=\"text-align: left;\"><strong>中国厂商（轻量化路径）：</strong> 阿里和Rokid引领“轻量化AI眼镜”潮流，避开重型头显的锋芒。阿里将展示夸克AI眼镜S1，搭载千问AI助手；Rokid Glasses则主打实时翻译、AR导航等实用场景。</p></li><li><p style=\"text-align: left;\"><strong>智能家居：</strong> 扫地机器人进入“微创新”阶段。科沃斯（X11 Omni Cyclone）和追觅不再单纯追求参数，而是通过引入旋风分离结构、GaN快充及四足越障技术，推动设备向自主服务的智能体进化。</p></li></ul></blockquote><h2 id=\"id_197719852\" style=\"text-align: left;\">汽车产业：从“软件定义”跃迁至“AI 定义”，芯片军备竞赛升级</h2><p style=\"text-align: left;\">汽车行业正经历技术架构的深层变革，智驾芯片的竞争格局日益清晰。</p><blockquote><ul style=\"\"><li><p style=\"text-align: left;\"><strong>芯片军备竞赛：</strong></p><ul style=\"\"><li><p style=\"text-align: left;\"><strong>英伟达：</strong> 凭借Thor芯片（2000 TOPS算力）主导L4级高端市场，极氪等车企计划2025年量产。</p></li><li><p style=\"text-align: left;\"><strong>高通：</strong> 虽AI算力不及英伟达，但凭借Snapdragon Ride Elite平台的“舱驾一体”架构，成功切入理想、奔驰供应链。</p></li><li><p style=\"text-align: left;\"><strong>Mobileye：</strong> 依靠EyeQ6 Lite在L2+级市场保持性价比优势，占据量产走量车型的高地。</p></li></ul></li><li><p style=\"text-align: left;\"><strong>整车技术：</strong> 吉利（银河A7搭载雷神AI电混2.0，热效率47.26%）和长城（VLA全场景大模型）展示了中国车企在架构革新上的领先优势。海外方面，宝马将展示基于Neue Klasse架构的iX3，集成Alexa+技术。</p></li></ul></blockquote><h2 id=\"id_1286510983\" style=\"text-align: left;\">硬件形态突围：联想的卷轴屏与电视厂商的 AI 画质战</h2><p style=\"text-align: left;\">面对传统硬件的创新天花板，厂商开始探索激进的形态突破。</p><blockquote><ul style=\"\"><li><p style=\"text-align: left;\"><strong>联想：</strong> 将展示ThinkBook Plus Gen 7 Auto Twist（AI驱动自动旋转屏幕）以及ThinkPad Rollable XD（卷轴屏笔记本）的实际可操作原型机，试图解决大屏与便携的矛盾。</p></li><li><p style=\"text-align: left;\"><strong>显示技术：</strong> TCL和海信继续深耕Mini-LED。TCL推出SQD-MiniLED，海信展示RGB-Mini LED，双方均重点强调AI图像处理器对画质的动态优化能力，试图用AI讲述新的显示故事。</p></li></ul></blockquote></body></html>","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>CES 2026前瞻：英伟达或重塑物理AI，中美韩机器人齐“秀肌肉”</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ 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0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nCES 2026前瞻：英伟达或重塑物理AI，中美韩机器人齐“秀肌肉”\n</h2>\n\n<h4 class=\"meta\">\n\n\n2026-01-04 13:48 北京时间&nbsp;&nbsp;&nbsp;<a href=https://wallstreetcn.com/articles/3762500><strong>华尔街见闻</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>CES 2026凸显芯片巨头战略分野：英伟达重心转向工业AI与机器人，而AMD与英特尔则坚守并升级传统PC市场。展会焦点已从消费电子转向人形机器人、AI定义汽车及卷轴屏等颠覆性硬件的产业化竞速，中、美、韩厂商在各赛道展开激烈角逐。2026年消费电子展（CES）将于1月4日至9日在美国拉斯维加斯举行，CES一向是科技企业发表年度新品的重要舞台，展品涵盖即将上市的产品，以及仍处于概念阶段、未必投产的...</p>\n\n<a href=\"https://wallstreetcn.com/articles/3762500\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"https://static.tigerbbs.com/e39f5931d4cf3fccc49c0e890fceb462","relate_stocks":{"LU1127390331.HKD":"AB SICAV I - ALL MARKET INCOME PORTFOLIO \"A\" (HKD) ACC","LU1934455863.HKD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"A\" (HKD) ACC","LU0079474960.USD":"联博美国增长基金A","IE00B3SWFQ91.USD":"PIMCO BALANCED INCOME AND GROWTH 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388H配备16核，最高频率5.1GHz。若能获得OEM广泛支持，将有助于缓解市场对其先进制程执行力的疑虑。具身智能战场：从中美韩“三国杀”看执行力进阶2026年被视为人形机器人从Demo走向工位的关键年份，核心看点在于“降本增效”与“实战验证”。中国阵营（成本与量产）： 宇树和智元继续主导成本控制。宇树或展示G1量产版在工厂流水线的操作；智元将展示X2、A2等全系列产品及灵巧手等核心部件。美国阵营（技术标杆）： 波士顿动力的全电动Atlas将进行首次公开演示，直接对标特斯拉Optimus，展示商业化潜力。韩国阵营（产业链抱团）： 韩国将展示“K-Humanoid”联盟，由三星投资的Rainbow Robotics领衔。展品包括轮式底盘工业级人形机器人HMND 01 Alpha（身高220厘米，载荷15公斤），显示出韩国在零部件到整机全产业链的整合野心。端侧 AI 与 XR：安卓阵营的反击与中国厂商的“轻量化”突围XR市场正在经历Apple Vision Pro发布后的“消化期”，CES 2026将是安卓阵营反击的起点。三星/谷歌联盟：三星将首秀获CES创新奖的Galaxy XR眼镜，搭载高通Snapdragon XR2+ Gen 3芯片，运行Android XR系统并深度集成Gemini AI，试图构建与苹果抗衡的生态。中国厂商（轻量化路径）： 阿里和Rokid引领“轻量化AI眼镜”潮流，避开重型头显的锋芒。阿里将展示夸克AI眼镜S1，搭载千问AI助手；Rokid Glasses则主打实时翻译、AR导航等实用场景。智能家居： 扫地机器人进入“微创新”阶段。科沃斯（X11 Omni Cyclone）和追觅不再单纯追求参数，而是通过引入旋风分离结构、GaN快充及四足越障技术，推动设备向自主服务的智能体进化。汽车产业：从“软件定义”跃迁至“AI 定义”，芯片军备竞赛升级汽车行业正经历技术架构的深层变革，智驾芯片的竞争格局日益清晰。芯片军备竞赛：英伟达： 凭借Thor芯片（2000 TOPS算力）主导L4级高端市场，极氪等车企计划2025年量产。高通： 虽AI算力不及英伟达，但凭借Snapdragon Ride Elite平台的“舱驾一体”架构，成功切入理想、奔驰供应链。Mobileye： 依靠EyeQ6 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