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Fred_6810
07-30

故事讲完了吗？

英特尔超大尺寸封装技术取得进展

据科创板日报，日前，英特尔超大尺寸封装技术取得进展，将能够制造出尺寸超过光刻掩模尺寸12倍的超大芯片。在英特尔位于新墨西哥州里奥兰乔的工厂里，其先进封装技术正在扩大“光罩极限”——将封装尺寸扩大到目前

英特尔超大尺寸封装技术取得进展

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