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跌了40%垃圾玩意

新思科技推出用于AI芯片设计的全新软件工具

新思科技周三推出全新软件工具，以应对人工智能芯片设计日益复杂的挑战。这是该公司以 350 亿美元收购工程软件公司安西斯后的首批新品。　　新思科技在硅谷一场会议上公布了这些新工具。　　新思科技首席执行官萨辛加齐表示，新工具旨在将这类工程能力集成到英特尔等芯片设计厂商已在使用的软件工具中。

新思科技推出用于AI芯片设计的全新软件工具

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00:41","market":"sg","language":"zh","title":"新思科技推出用于AI芯片设计的全新软件工具","url":"https://stock-news.laohu8.com/highlight/detail?id=2618924504","media":"环球市场播报","summary":"新思科技周三推出全新软件工具，以应对人工智能芯片设计日益复杂的挑战。这是该公司以 350 亿美元收购工程软件公司安西斯后的首批新品。　　新思科技在硅谷一场会议上公布了这些新工具。　　新思科技首席执行官萨辛加齐表示，新工具旨在将这类工程能力集成到英特尔等芯片设计厂商已在使用的软件工具中。","content":"<html><body><div>\n<p>　　新<span>思科</span><span></span>技（Synopsys）周三推出<strong>全新软件工具</strong>，以应对人工智能芯片设计日益复杂的挑战。这是该公司以 350 亿美元收购工程软件公司安西斯（Ansys）后的首批新品。</p>\n<p>　　<a href=\"https://laohu8.com/S/SNPS\">新思科技</a>在硅谷一场会议上公布了这些新工具。数十年来，该公司一直是芯片设计软件的主要供应商之一，其软件用于规划构成芯片的<a href=\"https://laohu8.com/S/SBAY\">数百亿</a>颗晶体管的布局，客户包括超威半导体（<span><a href=\"https://laohu8.com/S/AMD\">AMD</a></span><span></span>）、<a href=\"https://laohu8.com/S/NVDA\">英伟达</a>等公司 —— 英伟达去年曾向新思科技投资 20 亿美元。</p>\n<p>　　但 AMD 和英伟达的旗舰产品早已不再是单一芯片，而是由多颗更小的 “小芯片” 以愈发复杂的方式堆叠封装而成。</p>\n<p>　　这一趋势正是收购 Ansys 的原因：芯片设计师如今必须解决原本属于机械工程师领域的问题，例如小芯片运行时产生的热量是否会导致其翘曲、膨胀，进而出现开裂、与相邻芯片脱离，毁掉一块价值数万美元的复杂芯片。</p>\n<p>　　新思科技首席执行官萨辛・加齐表示，新工具旨在将这类工程能力<strong>集成到<span><a href=\"https://laohu8.com/S/INTC\">英特尔</a></span><span></span>等芯片设计厂商已在使用的软件工具中</strong>。</p>\n<p>　　“以往工程师们会以孤立的方式完成每个设计环节，” 加齐说，“最终结果就是产品成本更高，也无法发挥最大性能。我们把这些能力前置到设计阶段，从而实现更好的性能、更低的功耗，当然还有更低的成本。”</p>\n<div>\n<div><img src=\"\"/></div>\n<div>海量资讯、精准解读，尽在新浪财经APP</div>\n</div>\n<p>责任编辑：郭明煜 </p>\n</div></body></html>","source":"sina","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>新思科技推出用于AI芯片设计的全新软件工具</title>\n<style 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href=\"https://finance.sina.com.cn/stock/usstock/c/2026-03-12/doc-inhqrvzf9109702.shtml\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","LU0957791311.USD":"THREADNEEDLE (LUX) GLOBAL FOCUS \"ZU\" (USD) ACC","LU0390134368.USD":"FRANKLIN GLOBAL GROWTH \"A\" (USD) ACC","LU1303367103.USD":"摩根大通多经理另类基金 A (acc)","LU2098885051.SGD":"JPMorgan Funds - Multi-Manager Alternatives A (acc) SGD","BK4588":"碎股","SGXZ51526630.SGD":"大华环球创新基金A Acc SGD","LU2247934214.USD":"FIDELITY FUNDS SUSTAINABLE FUTURE CONNECTIVITY \"A\" (USD) ACC","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU1854103824.USD":"M&G (LUX) POSITIVE IMPACT \"A\" (USD) INC","LU2433249047.HKD":"THEMATICS META \"R/A\" (HKD) ACC","LU0957808578.USD":"THREADNEEDLE (LUX) GLOBAL TECHNOLOGY \"ZU\" (USD) ACC","SG9999004303.SGD":"Nikko AM Shenton Global Opportunities SGD","LU2458330243.SGD":"FRANKLIN SHARIAH 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SGD"},"source_url":"https://finance.sina.com.cn/stock/usstock/c/2026-03-12/doc-inhqrvzf9109702.shtml","is_english":false,"share_image_url":"https://static.laohu8.com/b0d1b7e8843deea78cc308b15114de44","article_id":"2618924504","content_text":"新思科技（Synopsys）周三推出全新软件工具，以应对人工智能芯片设计日益复杂的挑战。这是该公司以 350 亿美元收购工程软件公司安西斯（Ansys）后的首批新品。\n　　新思科技在硅谷一场会议上公布了这些新工具。数十年来，该公司一直是芯片设计软件的主要供应商之一，其软件用于规划构成芯片的数百亿颗晶体管的布局，客户包括超威半导体（AMD）、英伟达等公司 —— 英伟达去年曾向新思科技投资 20 亿美元。\n　　但 AMD 和英伟达的旗舰产品早已不再是单一芯片，而是由多颗更小的 “小芯片” 以愈发复杂的方式堆叠封装而成。\n　　这一趋势正是收购 Ansys 的原因：芯片设计师如今必须解决原本属于机械工程师领域的问题，例如小芯片运行时产生的热量是否会导致其翘曲、膨胀，进而出现开裂、与相邻芯片脱离，毁掉一块价值数万美元的复杂芯片。\n　　新思科技首席执行官萨辛・加齐表示，新工具旨在将这类工程能力集成到英特尔等芯片设计厂商已在使用的软件工具中。\n　　“以往工程师们会以孤立的方式完成每个设计环节，” 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